Samsung Electronics Co., Ltd.

Hyungil Kim

Jaehong Kim

Byounguk Yoon

Jongchul Choi

Minwoo Yoo

Yeonggyu Yoon

Seunghyun Hwang

Jongkeun Kim

Wonhee Choi

Jaeho Kang

Sangin Baek

Seungchul Baek

Se-Hyun Seo

Sangjae Rhee

Youngchyel Lee

A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.

Semiconductor package test system and semiconductor package fabrication method using the same

An unmanned aerial vehicle is disclosed. The unmanned aerial vehicle includes a frame configured to fix a motor. The unmanned aerial vehicle also includes a housing configured to enclose the frame. The housing includes a top mesh corresponding to an upper surface of the housing and a bottom mesh that covers a portion of a bottom surface of the housing. The housing also includes middle part coupled to the top mesh and the bottom mesh. The housing also includes a plurality of duct areas that penetrate each of the top mesh, the bottom mesh, and the middle part. The motor and a propeller connected to the motor and for rotating are positioned within the duct area.

Unmanned aerial vehicle having duct structure

Growing community of inventors

Suwon-si, South Korea

Hyungil Kim