Samsung Electronics Co., Ltd.

Hyungchul Cho

Youngwon Shin

Joonsung Lee

Hyunjae Jung

Heechul Lee

Jaehyoung Lee

Suhong Kim

A method of manufacturing a semiconductor device includes preparing etched mapping data by measuring an etching amount of a wafer subjected to an etching process, determining an error region in which the etching amount of the wafer is outside of a reference value, based on the etched mapping data, compensating distribution of an electrical field applied to the wafer, and compensating exhaust distribution of a process gas, changed by the compensating distribution of an electrical field.

Plasma apparatus and methods of manufacturing semiconductor device using the same

A shower head assembly for a plasma processing apparatus in which a substrate is accommodatable on a substrate stage within a chamber, a plasma processing apparatus, and a plasma processing method, the shower head assembly including a shower plate including a plurality of injection holes through which a gas is sprayable out toward the substrate; and a compensation plate on a lower surface of the shower plate and facing the substrate, the compensation plate including a first compensating portion having first gas passages of a first length and a second compensating portion having second gas passages of a second length that is greater than the first length, wherein the first gas passage and the second gas passage are respectively in fluid communication with the injection holes.

Shower head assembly and plasma processing apparatus having the same

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Suwon-si, South Korea

Hyungchul Cho