Samsung Electronics Co., Ltd.

Hyung-Su Son

Yu-sin Yang

Chung-sam Jun

Woo-seok Ko

Dong-Su Han

Jin-Yeol Yang

Hae-Gu Lee

Hyun-woo Kim

Sang-kil Lee

Young-Hwan Kim

Jeong-hoi Kim

Baek-man Sung

Chae-ho Shin

Jae-youn Wi

A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.

X-ray topographic apparatus and substrate processing system using the apparatus

Laser processing method, substrate dicing method and substrate processing system for performing the same

A conductive atomic force microscope including a plurality of probe structures each including a probe and a cantilever connected thereto, a power supplier applying a bias voltage, a current detector detecting a first current flowing between a sample object and each of the probes and a second current flowing between a measurement object and each of the probes, and calculating representative currents for the sample and measurement objects based on the first and second currents, respectively, and a controller calculating a ratio between representative currents of the sample object measured by each of the probe structures, calculating a scaling factor for scaling the representative current with respect to the measurement object measured by each of the probes, and determine a reproducible current measurement value based on the second measurement current and the scaling factor may be provided.

Conductive atomic force microscope and method of operating the same

A method for inspection of defects on a substrate includes positioning a probe of a scanning probe microscopy (SPM) over and spaced apart from a substrate, includes scanning the substrate by changing a relative position of the probe with respect to the substrate on a plane spaced apart from and parallel to the substrate, and includes measuring a value of an induced current generated via the probe in at least two different regions of the substrate. The value of the induced current is variable according to at least a shape and a material of the substrate. The method further includes determining whether a defect exists by comparing the values of the induced currents measured in the at least two different regions of the substrate.

Method for inspection of defects on a substrate

Growing community of inventors

Hwaseong-si, South Korea

Hyung-Su Son