Samsung Electro-mechanics Co., Ltd.

Hyung Seok Roh

Jong Pil Lee

Jung Il Kim

Doo Ho Yoo

Hyung Gon Kim

Hyun Jun Choi

Ichiro Tanaka

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Electronic component and manufacturing method thereof

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Growing community of inventors

Suwon-si, South Korea

Hyung Seok Roh