Samsung Electro-mechanics Co., Ltd.

Hyung Mi Jung

Yul Kyo Chung

Jin Seok Moon

Seung Eun Lee

Seok Bae

Choon Keun Lee

Jae Choon Cho

Seung Hyun Sohn

Mano Yasuhiko

Hyung Dong Kang

There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same

The invention provides a PCB with a thin film capacitor embedded therein and a method for manufacturing the same. The PCB includes a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode via low temperature film formation; a buffer layer formed on the amorphous paraelectric film; a metal seed layer formed on the buffer layer; and an upper electrode formed on the metal seed layer.

Printed circuit board with film capacitor embedded therein and method for manufacturing the same

In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material is sputtered via a second mask to form a dielectric layer. The conductive metal is sputtered via a third mask to form an upper electrode. An insulating layer is stacked on a stack body with the upper electrode formed therein and via holes are perforated from a top surface of the insulating layer to a top surface of the lower electrode and from the top surface of the insulating layer to a top surface of the upper electrode formed on the substrate. Also, the stack body with the via holes formed therein is electrolytically and electrolessly plated.

Method for manufacturing printed circuit board with thin film capacitor embedded therein

A planar magnetic inductor and a method for manufacturing the same are provided. The planar magnetic inductor comprises an insulating oxide magnetic layer formed on a substrate, a conductive coil separated from a lower surface of the insulating oxide magnetic layer while being completely embedded in the insulating oxide magnetic layer, and a cover layer formed on the insulating oxide magnetic layer for protecting the insulating oxide magnetic layer. The insulating oxide magnetic layer comprises a lower insulating oxide magnetic layer, and an upper insulating oxide magnetic layer formed on the lower insulating oxide magnetic layer, such that the conductive coil is completely embedded in the upper insulating oxide magnetic layer. The planar magnetic inductor can realize excellent high frequency characteristics and high inductance with a reduced scale.

Growing community of inventors

Gyunggi-do, South Korea

Hyung Mi Jung