Lg Innotek Co., Ltd.

Lg Innotekco., Ltd.

Hyung Kyu Yoon

Jun Young Lim

Woong Sik Kim

Min Hwan Kim

Hyun Gyu Park

Bi Yi Kim

Sung Min Chae

Seung Jin Lee

In Hee Cho

Hye Yeong Jung

Yong Hwa Park

Seok Bae

Ji Hye Kim

Soon Young Hyun

Man Hue Choi

Seung Jin Kim

Yong Jae Kwon

Hyung Eui Lee

Dae Sung Yoo

Seong Hwan Im

Jong Seok Park

Gi Uk Yang

Seung Soo Cho

A flexible circuit board comprises a substrate on which a chip mounting area is defined, a circuit pattern disposed on the substrate, and a protective layer on the circuit pattern, and the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of dummy patterns, and the first circuit pattern includes a first pad part, a second pad part, and a first wiring part connected to the first pad part and the second pad part, and the second circuit pattern includes a third pad part, a fourth pad part, and a second wiring part connected to the third pad part and the fourth pad part, and a through hole is disposed in an inner region of the first circuit pattern.

Flexible circuit board, COF module, and electronic device comprising the same

A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

Flexible circuit board

A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

Flexible circuit board and chip package including same

A coil member according to an embodiment comprises: a substrate including an upper surface and a lower surface opposite to the upper surface; a first coil electrode disposed on the upper surface of the substrate and including first pattern electrodes; a second coil electrode disposed on the lower surface of the substrate and including second pattern electrodes; and third pattern electrodes disposed on the upper surface and the lower surface of the substrate, wherein a distance between the first pattern electrodes is different from a distance between the first pattern electrodes and the third pattern electrodes, and a distance between the second pattern electrodes is different from a distance between the second pattern electrodes and the third pattern electrodes.

Image stabilizing coil member and camera module comprising same

A coil member according to an embodiment comprises: a substrate having a top surface and a bottom surface opposite the top surface; a first coil electrode disposed on the top surface of the substrate and including a first pattern electrode; and a second coil electrode disposed on the bottom surface of the substrate and including a second pattern electrode. The first coil electrode includes: a first outermost pattern electrode; a first innermost pattern electrode; and a central pattern electrode between the first outermost pattern electrode and the first innermost pattern electrode, wherein the line width of at least one of the first outermost pattern electrode or the first innermost pattern electrode is greater than the line width of the central pattern electrode.

Coil member for correcting hand-shake and camera module having the same

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

Flexible circuit board, COF module and electronic device including the same

A flexible circuit board includes a substrate a, a wiring pattern layer provided on the first surface of the substrate, a plating layer provided on the wiring pattern layer and including an open area, and a protective layer that contacts parts of the wiring pattern layer, the plating layer, and the substrate. The protective layer has a larger thickness than a thickness of the plating layer. The first protective layer includes a first overlapping region in which the plating layer and protective layer are in contact with each and a second overlapping region in which the plating layer and the protective layer are in contact with each other. A width of the first overlapping region may be different from a width of the second overlapping region, and each of the widths of the first and second overlapping regions is larger than a thickness of the plating layer.

An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

According to an embodiment, a flexible circuit board includes: a first substrate; a second substrate disposed on the first substrate and including an opening; a first conductive pattern part disposed on a bottom surface of the first substrate; a second conductive pattern part disposed on a top surface of the second substrate; a third conductive pattern part disposed between the first substrate and the second substrate; and an upper protective layer partially disposed on the second conductive pattern part and including a first open region, wherein the third conductive pattern part includes: a first inner lead pattern part disposed in the opening of the second substrate; and a first extension pattern part connected to the first inner lead pattern part, the second conductive pattern part includes: a second inner lead pattern part disposed in the first open region of the upper protective layer; and a second extension pattern part connected to the second inner lead pattern part, and a number of first inner lead pattern parts is greater than a number of second inner lead pattern parts.

Flexible circuit board, chip package including the same, and electronic device including the chip package

A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.

Flexible circuit board for all-in-one chip on film, chip package including same, and electronic device including same

A pressure detecting sensor according to an embodiment of the present invention comprises: a first electrode layer including a plurality of signal electrodes arranged in a first region and a plurality of wiring electrodes arranged in a second region and connected to the plurality of signal electrodes, the first electrode layer being made of a conductive fiber; an elastic dielectric layer arranged in the first region; and a second electrode layer arranged in the elastic dielectric layer, the second electrode layer being made of a conductive fiber.

Growing community of inventors

Seoul, South Korea

Hyung Kyu Yoon