Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Hyung Jun Cho

Jae Min Bae

Tae Yong Lee

Kyoung Yeon Lee

Byong Jin Kim

Gi Jeong Kim

Marc Alan Mangrum

Seung Mo Kim

Young Ju Lee

Seung Woo Lee

In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.

Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof

In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and includes a first electronic component first side, and a first electronic component second side opposite to the first electronic component first side. A second electronic component is coupled to a second lead step side, and includes a second electronic component first side, and a second electronic component second side opposite to the second electronic component first side. An encapsulant encapsulates the first electronic component, the second electronic component, and portions of the substrate. The lead terminals are exposed from a first side of the encapsulant. Other examples and related methods are also disclosed herein.

Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.

Packaged electronic device having integrated antenna and locking structure

Semiconductor device and a method of manufacturing a semiconductor device

A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad with a first major surface and a second major surface opposite to the first major surface, and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and is electrically connected to the conductive pillar structure, and at least a portion of the elongated conductive beam structure is exposed outside of the package body.

In one example, a semiconductor device comprises a substrate and an electronic device on a top side of the substrate, a lead frame on the top side of the substrate over the electronic device, wherein the lead frame comprises a connection bar and a lead, a component mounted to the connection bar and the lead on a top side of the lead frame, and an encapsulant on the top side of the substrate, wherein the encapsulant contacts a side of the electronic device and a side of the component. Other examples and related methods are also disclosed herein.

Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.

Growing community of inventors

Incheon, South Korea

Hyung Jun Cho