Samsung Electronics Co., Ltd.

Sang Won Co., Ltd.

Hyung Joo Lee

Gyu Sub Kim

Dong Yeon Kim

Chae Up Yoo

Nak Chung Choi

Jongwoo Sun

Jeongil Mun

Yoon Jae Lee

Won Joo Park

Kyeonghun Kim

Dong Seok Nam

Yoon Taek Han

Seuk Hwan Choi

Hyun Woo Lee

Jinwoo Jung

Jaehyun Lee

Hosaeng Kim

Jae Bong Chun

Se Hyun Park

Dongsoo Lee

Kuo-Cheng Chen

Jae Woon Park

Soon Ho Hwang

Jong Woo Sun

Sung Koo Park

Tae-Hwa Kim

Kangmin Jeon

Ahmed Hussain

Kyounghoon Han

You-Chieh Chen

Min Cheol Seo

Ho Jung Nam

Sung Hyup Lee

Chanhoon Park

Him Chan Yun

Kyeong Hun Kim

Jun Hwa Oh

Han Dug Lee

Byung Man Lim

Jeong Il Mun

See Yub Yang

Hong Pyo Bae

An electronic device is provided, which includes a housing; a conductive member forming at least a part of the housing; first to third nonconductive members separating the conductive member, wherein the conductive member includes a first conductive pattern disposed between the first nonconductive member and the second nonconductive member, and a second conductive pattern disposed between the second nonconductive member and the third nonconductive member; a first feeding part connected to the first conductive pattern; a second feeding part connected to the second conductive pattern; a first ground part connected to the first conductive pattern at a point adjacent to the second nonconductive member; and a communication circuit electrically connected with the conductive member.

Antenna for wireless communication and electronic device including the same

An electronic device is provided. The electronic device includes a housing including a first surface, a second surface disposed facing an opposite side of the first surface, and a side surface configured to surround at least a portion of a space between the first surface and the second surface, a first elongated metal member configured to form a first portion of the side surface and including a first end and a second end, at least one communication circuit electrically connected to a first point of the first elongated metal member through a capacitive element, at least one ground member disposed in an interior of the housing, and a first conductive member configured to electrically connect a second point of the first elongated metal member to the ground member. The second point of the first elongated metal member is disposed closer to the second end than to the first point.

Antenna and electronic device including the same

A critical dimension measurement system includes a voltage measurement circuit, a control circuit, and a critical dimension measurement circuit. The voltage measurement circuit may measure potentials of mask patterns of a photomask. The control circuit may include an information storage circuit for storing distribution information on the potentials of the mask patterns, measured by the voltage measurement circuit, and information on layout patterns corresponding to the mask patterns of the photomask. The critical dimension measurement circuit may be operated, by the control circuit, in a first measurement mode and a second measurement mode running for a shorter time than the first measurement mode, and measure critical dimensions of the mask patterns.

Critical dimension measurement system and method of measuring critical dimensions using same

An electronic device includes a cover glass, a display exposed through the cover glass, a housing for mounting the display, a first printed circuit board (PCB) and a second PCB that are disposed inside the housing, a back cover coupled to the housing, a first antenna element electrically connected to a ground area through the first PCB, and a communication circuit feeding the first antenna element and transmitting or receiving a signal through the first antenna element. A spaced distance between the first PCB and the display is longer than a spaced distance between the second PCB and the display.

Electronic device comprising antenna

A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.

Substrate processing apparatus, substrate processing module, and semiconductor device fabrication method

An optical emission spectroscopy system may include a reference light source, an analyzer to receive and analyze light transmitted from the reference light source, and a calibrator to calibrate light emitted from the reference light source. The calibrator may change a calibration ratio in accordance with an incidence angle of the light.

Optical emission spectroscopy system, method of calibrating the same, and method of fabricating semiconductor device

Disclosed is a vertical moving and swing type blender, which is capable of being moved vertically and swinging in right and left directions, thereby easily crushing food. The blender includes: a base member; a turning member configured such that a lower portion thereof is pivotally hinged to an upper portion of the base member; a main body disposed to be vertically movable in the turning member; a container member detachably coupled to an upper portion of the main body and configured to receive food, with a blade provided therein; a vertical elastic member elastically supporting the main body to allow the main body to be vertically movable in the turning member; and a horizontal elastic member configured such that a first end thereof is coupled to the base member and a second end thereof is coupled to the turning member so as to support the turning member horizontally and elastically.

Vertical moving and swing type blender

An electronic device including an antenna is provided. The electronic device includes a ground plane, an antenna element that is electrically connected to the ground plane through a first electrical path, a receptacle that accommodates an external connector that is electrically connected to the ground plane and comprises a conductive line, and a control circuit that is configured to: detect whether the external connector is inserted into the receptacle, and change the first electrical path to a second electrical path or add the second electrical path to the first electrical path between the antenna element and the ground plane, when the external connector is inserted into the receptacle.

Electronic device including antenna

A plasma monitoring apparatus includes a reflective structure disposed on a processing chamber providing a space in which plasma for processing a substrate is formed, the reflective structure configured to receive fragments of light incident in a plurality of incident directions from the plasma, and output the fragments of light in a plurality of exit directions by reflecting the fragments of light within the reflective structure; at least one light sensor configured to receive the fragments of light passing through the reflective structure in the plurality of exit directions; and at least one optical spectrometer connected to the at least one light sensor.

Plasma monitoring apparatus, and plasma processing apparatus including the same

An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate, the housing including at least one antenna element extended along one portion of the side member, a display exposed through the front plate and including a display panel and a shield layer, a wireless communication circuit electrically connected to the antenna element, a support member, at least a portion of which is positioned in the space in parallel with the shield layer, and a conductive patch layer interposed between the shield layer and the support member.

Growing community of inventors

Seongnam-si, South Korea

Hyung Joo Lee