Samsung Electro-mechanics Co., Ltd.

Postech Academy-industry Foundation

Other

Hyung Ho Kim

Dek Gin Yang

Won Woo Cho

Myung Gun Chong

Young Soo Kim

Jae Kwang Kim

Sang Ho Shin

Hyeon Yu Song

Yoon Jung Kim

Sung Jin Park

Yong Suk Kim

Young Seuck Yoo

Jung Soo Kim

Byung Kug Cho

Gun Se Chang

Seong Tae Jhang

Chu Shik Jhon

A coil component includes a wound coil having a winding portion, including at least one turn, and a lead-out portion extending from an end portion of the winding portion to form a separation space, together with the winding portion, the wound coil being formed of a metal wire having a surface on which an insulating coating portion is disposed, a body embedding the wound coil therein and including magnetic powder particles and an insulating resin, and an insulating layer disposed on at least one of a surface of the winding portion and a surface of the lead-out portion forming the separation space.

Coil component

A coil component includes a wound coil having a winding portion, having at least one turn, and a lead-out portion extending from an end portion of the winding portion to provide a separation space together with the winding portion and a body including an insulating resin and magnetic powder particles and embedding the wound coil therein. The body has a low-density portion disposed in the separation space and having magnetic powder particle density lower than average magnetic powder particle density of an entirety of the body.

A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.

Method of manufacturing a coil electronic component

A coil component includes a core including a winding portion and a flange portion extending from a first end of the winding portion, a coil wound around the winding portion, a lead formed at the flange portion, and a cover coupled to the flange portion and covering at least a portion of the coil.

Coil component and method for manufacturing the same

Disclosed is a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna.

Printed circuit board including electromagnetic bandgap structure

Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

Electromagnetic bandgap structure and printed circuit board having the same

Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

A distributed shared memory multiprocessor system based on a unidirectional ring bus using a snooping scheme comprises a group of processor nodes and a ring bus. The processor nodes are arranged in the form of a ring and one of the processor nodes generates a request signal for a data block, the remaining processor nodes snoop their own internal parts, and one of the remaining processor nodes provides the data block. The ring bus is used for connecting the processor nodes in the form of the ring and providing a path through which the request signal is broadcast to each of the remaining processor nodes and the data block is unicast to the processor node which has generated the request signal for the data block.

Growing community of inventors

Incheon, South Korea

Hyung Ho Kim