Lg Innotek Co., Ltd.

Hyung Eui Lee

Seok Bae

Soon Young Hyun

So Yeon Kim

Nam Yang Lee

Won Ha Moon

Jong Min Lee

Seung Yong Lee

Jong Hyun Kim

Hyuk Soo Lee

Sung Won Lee

Ji Yeon Song

Hyung Kyu Yoon

Jai Hoon Yeom

Yong Sang Cho

Man Hue Choi

Sung Wuk Ryu

Myoung Lae Roh

Sang Gon Kim

Boone Won

Jong Bae Shin

Young Sam Yoo

Yeong Uk Seo

Se Woon Lee

Jun Phil Hwang

Sook Hyun Kim

Don Chul Choi

Woo Chul Kim

Yong Jae Kwon

Yoo Min Eom

Hyun Sub Shin

Ji Yun Kim

Hwan Joo Park

A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; an insulation layer disposed on the first substrate; a first electrode disposed on the insulation layer; a bonding layer disposed on the first electrode; a semiconductor structure disposed on the bonding layer; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the upper surface of the insulation layer includes a first concave surface vertically overlapping the first electrode, the bonding layer includes a first area vertically overlapping the first concave surface and the semiconductor structure and a second area which vertically overlaps the first concave surface and does not vertically overlap the semiconductor structure, and a void density of the first area is smaller than that of the second area.

Thermoelectric element

A power-generating apparatus according to an embodiment of the present invention comprises: a housing in which a fluid flows along the interior thereof and at least a portion of the wall surface thereof includes a flat surface formed of metal; a thermoelectric module disposed on the flat surface of the housing; and an insulating member disposed on the flat surface of the housing so as to be beside the thermoelectric module.

Power-generating apparatus

A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.

Thermoelectric device and thermoelectric module

Provided are an elastomer composition including epoxy resin, acrylate resin, an organic filler, an inorganic filler, a cross linking agent, a hardener, an initiator and a solvent, and a magnetic ferrite for a wireless power transmitting and receiving device, the magnetic ferrite being coated with the elastomater composition having an elastic restoring force not to be damaged by a physical impact applied from the outside. According to embodiments of the present invention, the magnetic ferrite having improved impact resistance can be provided by being coating with the elastomer composition having the elastic restoring force, and thus an existing problem such as a reduction in magnetic property caused by damage to the ferrite resulting from an external impact can be solved.

Elastomer composition and magnetic ferrite coated with the same

Provided are an antenna for a communication terminal, and a method of manufacturing the same, the antenna including: a communication terminal case; and a radiator layer formed of a metal material in an inner curved surface part of the communication terminal case.

Antenna for communication terminal

A structure and a device may include an electromagnetic wave generator configured to generate electromagnetic waves; a shielding structure configured to surround at least a portion of the electromagnetic wave generator; and a metal layer provided on inner surfaces of upper and side portions of the shielding structure, wherein the metal layer having a predetermined surface roughness.

Structure for shielding electronomagnetic waves

Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet () and a coil part () disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet () member located at an edge portion and a second magnetic sheet member () located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.

Electromagnetic booster for wireless charging and method of manufacturing the same

Since the magnetic film of the present invention has a much thinner thickness compared to a corresponding conventional magnetic layer and radiator coil material assembly and has no adhesive layer or air layer between the magnetic layer and the radiator, permeability required at the time of charging can be improved, a loss rate can be reduced and high charging efficiency can be obtained, Furthermore, since a band width and a gain rate can be improved, the magnetic film can be very usefully applied to wireless charging products which pursue slimming in design.

Magnetic film having wireless charging radiator condition, method of manufacturing the same, and wireless charging device using the same

Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Thermoelectric material and thermoelectric element including the same

The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.

Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut

Growing community of inventors

Seoul, South Korea

Hyung Eui Lee