Samsung Electro-mechanics Co., Ltd.

Hyung Duk Yun

Dong Hwi Shin

Do Young Jeong

Young Hoon Song

A Ra Cho

Eun Hee Jeong

Byeongguk Choi

Seonyoung Yoo

Yuseop Lee

Ga Young An

Byung Jun Jeon

Ho In Jun

Min Hyang Kim

Chae Min Park

Yong Won Seo

Jeong Mo Kang

Seon Young Yoo

Seung Hyun Park

Yu Seop Lee

Hong Gi Kim

Donghwi Shin

Hoin Jun

Jeongmo Kang

Kyeongmo Park

A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 μm×5 μm region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 μm or greater.

Multilayer electronic component

Disclosed is a multilayered capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode outside the capacitor body, wherein the external electrode includes a first layer disposed outside the capacitor body and including a conductive metal and glass, the first layer includes a glass portion disposed at a portion meeting the dielectric layer and including the glass, and the glass portion has an extended portion extending into the capacitor body along a gap between the dielectric layer and the internal electrode.

Multilayered capacitor and method for manufacturing the same

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween, a first external electrode and a second external electrode connected to the first and the second internal electrode respectively. The first external electrode includes a first base electrode layer disposed in contact with the ceramic body, a first glass layer disposed on the first base electrode layer, and a first resin electrode layer disposed on the first glass layer. The second external electrode includes a second base electrode layer disposed in contact with the ceramic body, a second glass layer disposed on the second base electrode layer, and a second resin electrode layer disposed on the second glass layer.

Multilayer ceramic electronic component with a multilayer external electrode

A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode. The first external electrode includes a first electrode layer disposed to be in contact with the ceramic body, and a first conductive layer disposed on the first electrode layer. The second external electrode includes a second electrode layer disposed to be in contact with the ceramic body, and a second conductive layer disposed on the second electrode layer. The first conductive layer and the second conductive layer are plating layers. The first conductive layer and the second conductive layer are porous.

Multi-layer ceramic electronic component

A multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and first and internal electrodes disposed to be stacked with the dielectric layer interposed therebetween; a first and a second external electrode disposed on the ceramic body. The first and the second external electrodes may include a first and a second base electrode layers disposed in contact with the ceramic body and a first and a second resin electrode layers disposed on the first and the second base electrode layer respectively, a width of the ceramic body in the second direction may be less than 1.0 mm, and 0.4×ta≤tb≤0.5×ta in which ta is an average thickness of the first base electrode layer and tb is an average thickness of the first resin electrode layer.

Multilayer ceramic electronic component

A multilayer electronic component includes a body including an active portion inducing dielectric layers and internal electrodes, and upper and lower cover portions, and external electrodes including connection portions and band portions extending onto portions of first and second surfaces of the body, and including an electrode layer and a conductive resin layer. In a cross-section of the body, when a line along which the band portion of the conductive resin layer is in contact with the first surface is d, an area of an isosceles right triangle, in which d is a base and an extension line extending from an end of the electrode layer by a length of d is a height, is K, and a ratio of the area occupied by dummy electrodes in the lower cover portion and the internal electrodes in Kto Kis K, Kis 20% or more.

Multilayer electronic component with dummy internal electrodes

A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, and a capacitance forming portion disposed in such a manner that first and second internal electrodes are stacked with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the ceramic body, respectively, the first and second external electrodes including first and second base electrodes connected to the first and second internal electrodes, respectively, and first and second conductive layers disposed to cover the first and second base electrodes, respectively. The first and second conductive layers have a thickness in a range of 0.1 &#x3bc;m to 10 &#x3bc;m.

A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes; a first external electrode including a first electrode layer connected to the first internal electrodes, a first conductive resin layer on the first electrode layer, and a first plating layer on the first conductive resin layer, and including a first connection portion on a third surface of the body and a first band portion extending on first and second surfaces of the body; and a second external electrode connected to the second internal electrodes. L-Lis greater than 10 &#x3bc;m in which Lis a distance from the third surface to a distal end of the first conductive resin layer in the first band portion, and Lis a distance from the third surface to a distal end of the first plating layer in the first band portion.

A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

Multilayer ceramic electronic component and manufacturing method thereof

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively. The first and second external electrodes comprise first and second base electrodes disposed to be in contact with the ceramic body and having a first conductive metal, and first and second conductive layers disposed on the first and second base electrodes and having a second conductive metal, and the first and second conductive layers have an average surface roughness (Ra) of 10.0 &#x3bc;m or more.

Multilayer ceramic electronic component including external electrode having surface roughness

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, and including first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, the first and second external electrodes include first and second base electrodes including a first conductive metal and reactive glass, in contact with the ceramic body, and first and second conductive layers including and a second conductive metal, disposed on the first and second base electrodes, and a nanostructure may be disposed on surfaces of the first and second conductive layers.

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Suwon-si, South Korea

Hyung Duk Yun