Samsung Electro-mechanics Co., Ltd.

Hyung Chan Kwak

Ho Kyoum Kim

Gab Yong Kim

Kwang Youel Raa

A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.

Camera module package

Surveillance camera

A camera module package comprises an image sensor having a light receiving section formed in the central portion of the upper surface thereof and a plurality of bumps formed around the light receiving section; an FPCB that is closely bonded to the image sensor by a flip chip, the FPCB having a plurality of via holes perforated at bonding positions corresponding to the bumps such that the bumps and the via holes are closely bonded to each other one to one; and an optical unit having a housing received on the FPCB and a lens barrel screwed to the central portion of the housing.

Growing community of inventors

Gyunggi-do, South Korea

Hyung Chan Kwak