Qualcomm Incorporated

Hyunchul Cho

Jaehyun Yeon

Suhyung Hwang

Kun Fang

Boyu Tseng

Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern mufti-directionality, and related fabrication methods. The antenna module includes a radio-frequency (RF) IC (RFIC) package that includes one or more RFICs for supporting RF communications and a package substrate that includes one or more metallization layers with formed metal interconnects for routing of signals between the RFICs and multiple antennas in the package substrate. To provide multi-directionality in antenna radiation patterns, a first antenna is provided that is coupled to the package substrate and oriented in a first plane, and a second antenna is provided that coupled to the package substrate and oriented in a second plane orthogonal to the first plane. In an example, the second antenna is packaged in an antenna package that includes external metal pads that when surface mounted to the package substrate, cause the second antenna to oriented in the second plane.

Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods

A package that includes a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes at least one dielectric layer, a first plurality of high-density interconnects located in the at least one dielectric layer and through a first surface of the at least one dielectric layer; a second plurality of high-density interconnects located in the at least one dielectric.

Package comprising a substrate with high density interconnects

A package that includes a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer and a plurality of interconnects comprising a first via interconnect and a first trace interconnect, wherein the first via interconnect is directly coupled to the first trace interconnect. The first via interconnect is coupled to the first trace interconnect without an intervening pad interconnect between the first via interconnect and the first trace interconnect.

Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same

A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.

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Suwon, South Korea

Hyunchul Cho