Samsung Electronics Co., Ltd.

Hyunah Kim

Jaehyoung Sim

Eomji Jang

Sungjune Cho

Seonuk Na

Joonhyoung Kim

Hyungmo Koo

Youjae Kim

Dongho Cho

Dongwoo Kim

Un-Byoung Kang

Chungsun Lee

Ji-seok Hong

Donghyun Kim

Junho Choi

Hyojin Kim

Hyeongjoon Seo

Kwangnam Shin

Jeongkyo Oh

Jonghyeon Chang

Younghyun You

Younghwan Jin

A buried type air purifier including a main body to be buried in a buried space through a buried opening provided on a boundary surface between a use space and the buried space, the main body having an intake passage and a discharge passage which take in and discharge air, respectively; a fan to guide air of the use space along the intake passage and the discharge passage; and a filter to filter the air. The main body includes: a first main body part having a fan accommodating part to accommodate the fan; and a second main body part having a cross sectional area, which is parallel with the boundary surface, being smaller than the first main body part, where the second main body part is formed to pass the intake and discharge passages through which the air guided via the fan accommodated in the fan accommodating part passes.

Buried type air purifier

A substrate debonding apparatus includes a chuck attached to a second surface opposite to the first surface of the semiconductor substrate via a second adhesive layer. The chuck is configured to support a lower portion of a base film having a cross-sectional area in a horizontal direction greater than a cross-sectional area of the semiconductor substrate in the horizontal direction. The semiconductor debonding apparatus further includes a fixing ring arranged above the chuck and configured to fix in position an edge portion of the base film, and a cover ring arranged above the fixing ring and configured to adjust a diameter of an opening exposing the carrier substrate. The cover ring includes a guide frame arranged above the fixing ring, and a plurality of cover blades configured to move in a horizontal direction determined by the guide frame.

Substrate debonding apparatus

Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same. The interconnection structure comprises a first dielectric layer, a wiring pattern formed in the first dielectric layer, a portion of the wiring pattern exposed with respect to a top surface of the first dielectric layer, a second dielectric layer on the first dielectric layer, the second dielectric layer including an opening that exposes the exposed portion of the wiring pattern, a pad formed in the opening of the second dielectric layer, the pad including a base part that covers the exposed portion of the wiring pattern at a bottom of the opening and a sidewall part that extends upwardly along an inner lateral surface of the opening from the base part, a first seed layer interposed between the second dielectric layer and a first lateral surface of the sidewall part, the first seed layer being in contact with the first lateral surface and the second dielectric layer, and a second seed layer that conformally covers a second lateral surface of the sidewall part and a top surface of the base part, the second lateral surface being opposite to the first lateral surface the second dielectric layer.

Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure

Disclosed are a ventilation apparatus and an air conditioner including the same. The air conditioner includes a main body including a heat exchanger and a blower fan blowing indoor air to pass through the heat exchanger, and a ventilation apparatus mounted on the main body to ventilate a room, the ventilation apparatus includes a case configured to accommodate a ventilation fan, a ventilation pipe including an inlet tube mounted on an outdoor air inlet of a building and an extension tube connecting a flow path of the case and the inlet tube and detachably connected to the inlet tube, and a ventilation filter installed in the ventilation pipe through a connection portion between the inlet tube and the extension tube to filter out foreign substances in air.

Ventilation apparatus and air conditioner including the same

An air conditioning apparatus is disclosed. The air conditioning apparatus includes a filter, a fan configured to generate an air flow, a case configured to accommodate the filter and the fan within, and including a support member supporting the filter, and a sealing member covering a gap between the case and the filter, and the filter includes a side-surface member formed along a side-surface, and at least one from among the support member and the side-surface member is formed with a groove which transfers pressure of an upstream side of the filter to the sealing member based on the fan operating.

Filter assembly and air conditioning apparatus having the same

An air conditioner includes an indoor unit to be installed in indoor space, an outdoor unit to be installed in outdoor space, the outdoor unit being separated by a building wall from the indoor space, a refrigerant pipe to connect the indoor unit with the outdoor, a ventilation pipe to connect the indoor unit to the outdoor space, a ventilation device to be arranged in the indoor space and to be connected to the ventilation pipe to ventilate indoor air in the indoor space to outdoor space or outdoor air in the outdoor space to the indoor space through the ventilation pipe, and a sleeve to be installed to pass through a hole formed at the wall to guide the refrigerant pipe and the ventilation pipe therethrough.

Air conditioner and pipe installation apparatus therefor

An air conditioner includes a main body including a body fan, a heat exchanger, and a body housing. A ventilation hose connects the main body to outdoor air. A ventilation module is attached to an outer side of the body housing, and includes a ventilation fan. The ventilation module switches between an exhaust mode in which indoor air is exhausted to the outdoors through the ventilation hose and an air supply mode in which outdoor air is supplied to the main body through the ventilation hose.

Air conditioner and ventilation apparatus for the same

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Suwon-si, South Korea

Hyunah Kim