Ms Autotech Co., Ltd.

Toshiba Samsung Storage Technology Korea Corporation

Hyundai Motor Company

Kia Motors Corporation

Samsung Sdi Co., Inc.

Myungshin Industry Co., Ltd.

Hyun Woo Lee

Jang Soo Kim

Dae Ho Yang

Woo Young Kim

Jong Won Lee

Sang Hun Kim

Min Woo Song

Bum Wook Roh

Chang Ho Jung

Kwang Min Oh

Su Hwan Cho

Hyouk Kim

In Sung Chang

Tae Kyu Lee

Ji Ho Lee

Young Gi Lee

Young Sun Choi

Hong Kyo Jin

Soo Yeon Sim

Chang Suk Lee

Hag Ryeol Kim

Min Shik Roh

Ju Hong Kim

A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition comprising a solvent; an abrasive agent; and a dendritic poly(amidoamine) containing a terminal functional group that has a pKa of about 6 or less.

CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same

A nozzle device includes: a charging nozzle configured to supply a charging fluid and provided to be connected to a receptacle provided in a subject; a cover member to surround the charging nozzle and the receptacle; and a fluid supply unit to supply an interior of the cover member with an anti-freezing fluid for inhibiting freezing between the charging nozzle and the receptacle, thereby obtaining an advantageous effect of preventing freezing of the receptacle and improving safety and reliability. In addition, the nozzle device may include a hydrophobic coating layer for inhibiting freezing.

Fluid charging system, nozzle device, and receptacle device

Provided is a hot stamping die apparatus including sub-assemblies constructed by making a plurality of plates erect and sequentially overlapping the plurality of plates in a face-to-face manner. A first cooling channel extending along overlapping surfaces is provided by forming grooves corresponding to each other on overlapping surfaces of adjacent plates, A second cooling channel passing through the corresponding sub-assembly in the length direction is provided in at least one of the sub-assemblies.

Hot stamping die apparatus

Provided is an apparatus for forming steel workpieces using electroplasticity. The apparatus includes a power supply () for supplying electricity to the workpiece (W) through electrodes () disposed in a mold () of a press () during a deformation stroke of the press (), a control unit () for controlling the power supply () and a plurality of sensors (and).

Apparatus for forming a steel workpiece

Provided is a bushing for manufacturing a three-dimensional composite preform using a tow made of a fiber reinforced polymer. The bushing includes a base plate in which one or more through-holes are formed, and a plurality of spools spaced apart from each other on the base plate. A flat top is formed at an end portion of the spools, and grooves are formed on outer surfaces of the plurality of spools in a circumferential direction thereof.

Bushing for manufacturing structural composite preform

An optical device and method are provided including a spindle motor mounted in a turn table on which an optical disk is attached and detached. The optical device includes a bracket secured with a stator of the spindle motor. The optical device also includes a tray body directly connected to the bracket. A skew angle of the spindle motor is adjusted while the bracket is assembled to the tray body, and an adjusting method of the optical device.

Optical device and adjusting method thereof

An optical device is provided including a tray body linearly moving and loading an optical disk. A case guide is configured to guide the linear movement of the tray body. A damper is interposed between the tray body and the case guide to attenuate vibration of the tray body.

Optical device

Growing community of inventors

Suwon-si, South Korea

Hyun Woo Lee