Lg Chem, Ltd

Hyun-Woo Choi

Cheol-Hee Park

Byung-Kyu Lim

Tae-Hoon Kim

Jae-Ki Lee

Eun-Ah You

O-Jong Kwon

Dong-Sik Kim

Seung-Hyup Lee

Myung-Jin Jung

Dae-Ki Lee

Ye-Rok Park

The present disclosure discloses a thermoelectric module to which a bonding technique for stably driving the thermoelectric module at high temperatures is applied and a method of manufacturing the thermoelectric module. The thermoelectric module according to the present disclosure includes thermoelectric elements including a thermoelectric semiconductor, an electrode which includes a metal material and is connected between the thermoelectric elements, and a bonding layer which is interposed between the thermoelectric element and the electrode to bond the thermoelectric element with the electrode and includes a metal compound including metals of two or more classes as a sintered body of a paste including metal powders of two or more classes.

Thermoelectric module and manufacturing method thereof

Disclosed is a new compound semiconductor material which may be used for thermoelectric material or the like, and its applications. The compound semiconductor may be represented by Chemical Formula 1 below: Chemical Formula 1 &#x3c;Chemical Formula 1&#x3e; BiTeSeInMwhere, in Chemical Formula 1, M is at least one selected from the group consisting of Cu, Fe, Co, Ag and Ni, 2.5&#x3c;x&#x3c;3.0, 3.0&#x2266;a&#x3c;3.5, 0&#x3c;y and 0&#x2266;z.

Compound semiconductors and their application

Growing community of inventors

Daejeon, South Korea

Hyun-Woo Choi