Growing community of inventors

Gyeonggi-do, South Korea

Hyun-Sung Lee

Average Co-Inventor Count = 1.80

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 24

Hyun-Sung LeeChun-Seok Jeong (3 patents)Hyun-Sung LeeMin-Su Kim (1 patent)Hyun-Sung LeeJae-Phil Boo (1 patent)Hyun-Sung LeeKwang-Hee Lee (1 patent)Hyun-Sung LeeSang-Seon Lee (1 patent)Hyun-Sung LeeJun-Gyu Ryu (1 patent)Hyun-Sung LeeJong-Bok Kim (1 patent)Hyun-Sung LeeKee-Teok Park (1 patent)Hyun-Sung LeeWoo-Sung We (1 patent)Hyun-Sung LeeHyun-Joo Yun (1 patent)Hyun-Sung LeeHyun-Sung Lee (9 patents)Chun-Seok JeongChun-Seok Jeong (44 patents)Min-Su KimMin-Su Kim (126 patents)Jae-Phil BooJae-Phil Boo (18 patents)Kwang-Hee LeeKwang-Hee Lee (17 patents)Sang-Seon LeeSang-Seon Lee (9 patents)Jun-Gyu RyuJun-Gyu Ryu (8 patents)Jong-Bok KimJong-Bok Kim (6 patents)Kee-Teok ParkKee-Teok Park (1 patent)Woo-Sung WeWoo-Sung We (1 patent)Hyun-Joo YunHyun-Joo Yun (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Skhynix Inc. (6 from 11,004 patents)

2. Samsung Electronics Co., Ltd. (2 from 131,744 patents)

3. Sk Hynic Inc. (1 from 6 patents)


9 patents:

1. 10311935 - Semiconductor device and method of driving the same

2. 9972378 - Base chip and semiconductor package including the same

3. 9972372 - Signal shifting circuit, base chip, and semiconductor system including the same

4. 9741411 - Bank control circuit and semiconductor memory device for data access with limited bandwidth for commands

5. 9620194 - Stacked memory device having serial to parallel address conversion, refresh control unit, and pipe control unit

6. 9401187 - Integrated circuit and precharge/active flag generation circuit

7. 9251912 - Semiconductor memory device and method of wafer burn-in test for the same

8. 7044833 - Apparatus for transporting and polishing wafers

9. 6840846 - Polishing station of a chemical mechanical polishing apparatus

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as of
1/4/2026
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