Samsung Electronics Co., Ltd.

Hyun-Sun Mo

Choong-Keun Kwak

Du-Eung Kim

Sang-Ki Hwang

Methods of programming a multi-bit non-volatile memory device are provided. The multi-bit non-volatile memory device includes a memory cell array including a plurality of memory cells and a storage unit electrically coupled to the memory cell array. A first bit (FB) of multi-bit data is programmed from the storage unit into one of the plurality of memory cells in the memory cell array. A second bit (SB) of multi-bit data is programmed from the storage unit into one of the plurality of memory cells in the memory cell array using data inversion. Related memory devices are also provided.

Methods of programming multi-bit flash memory devices and related devices

There is provided an internal voltage generating circuit that reliably supplies a constant internal voltage to the interior of a semiconductor device without regard to an external voltage, where the internal voltage generating circuit compares a first reference voltage with a first internal voltage fed back to generate the first internal voltage following the first reference voltage, receives the first internal voltage to generate a second reference voltage which is more insensitive to fluctuation of the external voltage than the first reference voltage, and compares the second reference voltage with a second internal voltage fed back to generate the second internal voltage which follows the second reference voltage and has a variation gradient smaller than that of the first internal voltage when the external voltage is changed, thereby supplying the second internal voltage to a circuit requiring stabilized internal voltage, which is obtained to increase stability and durability of the operation of the semiconductor device.

Circuit for generating internal voltage

A semiconductor memory device having memory cells connected with pairs of bit lines and word lines comprises a pre-charging part for pre-charging a pair of bit lines in response to a first state control signal at a stand-by mode of the semiconductor memory device; a bit line charging control part for generating a second state control signal to the pre-charging part when a stand-by current failure occurs due to defect in the pair of bit lines, wherein the second state control signal is independent of a pre-charge relating signal externally applied and the pre-charging part cuts-off a supply voltage from being applied to the pair of bit lines with defect; and a bit line floating prevent part for compensatively fixing potential values of the pair of bit lines with defect so that a cell supply voltage is prevented from being applied to the pair of bit lines with defect at a memory access mode of the semiconductor memory device, so that a hard type defect like a stand-by current failure can be repaired regardless of a logic state of a pre-charge control signal, thereby reducing the probability of occurrence of defect in a semiconductor memory device.

Semiconductor memory device with function of repairing stand-by current failure

A static random access memory (SRAM) device comprises an array of memory cells, a plurality of bit line precharge circuit for selectively delivering current to bit lines in response to a pair of control signals, during normal and burn-in test modes, and a burn-in current source circuit for selectively delivering current to the memory cells selected by the word lines along with the precharge circuit, in response to the control signals, during the burn-in test mode. In burn-in write operation, memory cells can be supplied with enough cell current without large increasing of chip size and power consumption in normal operation mode.

Growing community of inventors

Seoul, South Korea

Hyun-Sun Mo