Samsung Electro-mechanics Co., Ltd.

Hyun Sub Oh

Hong Kyu Shin

Youn Soo Kim

Jae Bum Cho

Jin Ho Hong

Jae Kwang Kim

Hee Sung Choi

Wan Suk Yang

Ji Hong Jo

Kyoung Jin Cha

Hyung Soon Kwon

Hyun Ho Shin

Seung Heui Lee

Yong Hyun Lee

Young June Lee

Jeong Oh Hong

Jae Jun Park

Kyoung Sup Choi

Oh Choon Kwon

Seon Uk Hwang

A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.

Tantalum capacitor including conductive polymer layer having a filler

A tantalum capacitor includes: first and second surfaces facing in a first direction, third and fourth surfaces facing in a second direction, and fifth and sixth surfaces facing in a third direction; a tantalum body having one surface through which a tantalum wire is exposed in the first direction; and a substrate on which the tantalum body is mounted, wherein the substrate may be an organic-inorganic composite substrate.

Tantalum capacitor and manufacturing method thereof

A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35&#x2264;t2/t1&#x2264;0.9.

Solid electrolyte capacitor and fabrication method thereof

A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet containing a ceramic powder and forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive. A ceramic laminate is formed by stacking the ceramic green sheets on which the internal electrode pattern is formed. A ceramic body including dielectric layers and internal electrodes is formed by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.

Method of manufacturing multilayer ceramic electronic component

A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

Tantalum capacitor

A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.

Tantalum capacitor and method of manufacturing the same

There is provided a tantalum capacitor, including: a capacitor body including a tantalum powder and having a tantalum wire, a molding part formed to expose an end portion of the tantalum wire and enclose the capacitor body, an anode lead frame including an anode mounting part and an anode terminal part, the anode terminal part being connected to the tantalum wire, a thin plate electrode formed on a lower surface of the capacitor body and exposed through the other end surface of the molding part, and a cathode lead frame including a cathode mounting part and a cathode terminal part, the cathode terminal part being connected to the thin plate electrode.

Disclosed is a solid electrolytic capacitor, wherein a capacitor element has a front surface from which an anode lead wire is protruded. A cathode layer is formed on an outer surface of the capacitor element. A flat-shaped cathode lead frame is surface-contacted with an entire rear surface of the capacitor element. A flat-shaped anode lead frame has a concave portion formed at a central end portion thereof, in which the anode lead wire of the capacitor element is seated and electrically connected to the concave portion. A mold is formed to surround the capacitor element, to partially surround the anode lead frame, and to contact a face of the cathode lead frame which is surface-contacted with the capacitor element.

Solid electrolytic capacitor and manufacturing method

A tantalum chip capacitor with a cut-grooved anode lead frame is disclosed. The cut-grooved lead frame is designed to allow the tantalum element set in the small-sized epoxy mold package of the capacitor to have a desired size, thus restricting an increase in impedance of the tantalum chip capacitor regardless of a reduction in the size of the package according to the recent trend of smallness of the tantalum chip capacitors. This tantalum chip capacitor has a tantalum element, a anode lead wire extending from the tantalum element, and a cathode lead frame attached at its inside end to the tantalum element and forming a mounting terminal at its outside end. The cut-grooved anode lead frame is welded at its inside end to the lead wire while overlapping a part of the lead wire at the inside end having the cut groove. This anode lead frame also forms a mounting terminal at its outside end. A mold package encloses the tantalum element, the lead wire, a part of the cathode lead frame attached to the tantalum element, and a part of the anode lead frame welded to the lead wire.

Growing community of inventors

Suwon-si, South Korea

Hyun Sub Oh