Kwangju Institute of Science and Technology

Gwangju Institute of Science and Technology

Hyun Sang Hwang

Jaesik Yoon

Sang Hun Jeon

A resistance RAM includes a first electrode, an oxide layer that is formed on the first electrode, a solid electrolyte layer that is disposed on the oxide layer, and a second electrode that is disposed on the solid electrolyte layer. A method of forming the resistance RAM includes forming a conductive tip in the oxide layer by applying reference voltage to any one of the electrodes of the resistance RAM, and applying foaming voltage to the remaining one, such that the oxide layer is electrically broken. A conductive filament is formed in the solid electrolyte layer by applying a positive voltage to the second electrode, and the conductive filament that is formed in the solid electrolyte layer is removed by applying a negative voltage to the second electrode.

Resistance RAM having oxide layer and solid electrolyte layer, and method for operating the same

Disclosed is a method of manufacturing a high-k gate dielectric, characterized in that an annealing process in a forming gas atmosphere, corresponding to a final step of a manufacturing process of a semiconductor device based on MOSFET fabrication techniques, is applied for a high-k gate dielectric-containing semiconductor device, under high pressure, instead of conventional atmospheric pressure, whereby passivation effects of interface charges and fixed charges of the semiconductor device can be maximized even at relatively low temperatures.

Method of manufacturing high-k gate dielectric by use of annealing in high-pressure hydrogen atmosphere

Disclosed is a method of fabricating gate dielectric for use in semiconductor device having a high dielectric constant comprising formation of a metal oxide or a metal silicate on a silicon substrate, nitridation to incorporate nitrogen component to said metal oxide and reoxidation of said metal oxide that contains said nitrogen component. In this invention, the nitridation can be performed via heat-treatment of the resulting product, wherein said metal oxide is formed within, in a nitrogen-containing gas atmosphere; performed by plasma treatment by exposing said metal oxide to a nitrogen-containing plasma atmosphere; or performed by ion instillation of nitrogen component to said metal oxide, thereby providing a gate dielectric for use in semiconductor device which is able to remarkably inhibit the increase in effective thickness resulted from a post heat-treatment at high temperature by forming a film of metal oxide such as ZrO followed by nitridation and reoxidation.

Growing community of inventors

Kwangju, South Korea

Hyun Sang Hwang