Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Hyun Mo Ku

Deog Soon Choi

Sarah Kay Haney

Ah Ron Lee

Chris Chung

Li Sun

Jin Jeong

Nitesh Kumbhat

Chang Kyu Choi

Lea-Teng Lee

A system and method for dissipating heat from a package and reducing interference between signaling pins is disclosed. The system includes a circuit substrate that includes a dielectric layer and at least one metal layer having an external surface. A plurality of metal posts is disposed on the external surface that function to a least one of dissipate heat from the circuit substrate, shield interfering signals between the signaling pins, and interact with mounting substrates on corresponding componentry. One or more metal posts are merged, increasing the interference shielding and heat dissipation functions of the metal posts.

Thermal dissipation and shielding improvement using merged PCB bottom copper post

A module includes a printed circuit board (PCB) having a substrate, component pads on a top surface of the substrate, and contact pads formed on a bottom surface of the substrate. The module further includes a mold compound disposed over the PCB; an external shield disposed over a top surface of the mold compound and on side surfaces of the mold compound and the PCB, where the external shield is configured to provide shielding of at least one component connected to at least one component pad from electromagnetic radiation; and a back-spill barrier formed on the bottom of the substrate. The back-spill barrier surrounds the contact pads, and is configured to prevent the external shield from making contact with the contact pads.

Module with external shield and back-spill barrier for protecting contact pads

A PCB includes a copper seed layer, a dielectric layer provided on the copper seed layer, a first thermal via and a plurality of second thermal vias disposed around the first thermal via. The first thermal via has a first through-hole in the dielectric layer and a first copper portion filled in the first through-hole, and each of the second thermal vias has a second through-hole in the dielectric layer and a second copper portion filled in the second through-hole. A mounting portion configured to mount a semiconductor device thereon is provided on the first copper portion.

Printed circuit board with thermal via

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Seoul, South Korea

Hyun Mo Ku