Cheil Industries Inc.

Samsung Electronics Co., Ltd.

Kudko Chemical Co., Ltd.

Hyun Min Choi

Arum Yu

Young Woo Park

Dong Seon Uh

Kyoung Soo Park

Nam Ju Kim

Joon Mo Seo

Kyung Il Sul

Ji Eun Kim

Jae Sun Han

Jong Hyuk Eun

Jin Seong Park

Shin Cheol Min

Ji Hoon Yoon

A semiconductor device includes a first connecting member having a first electrode, a second connecting member having a second electrode, and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other. The anisotropic conductive film includes a polymer binder resin, an epoxy resin, conductive particles, and a curing agent. The epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin. The naphthalene ring-containing epoxy resin is included in an amount of 100 parts by weight to 500 parts by weight based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin.

Semiconductor device connected by anisotropic conductive film

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

Anisotropic conductive film and semiconductor device bonded by the same

An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, where, in Formula 1, Rmay be selected from the group of hydrogen, C-Calkyl, C-Caryl, &#x2014;C(&#x2550;O)R, &#x2014;C(&#x2550;O)OR, and &#x2014;C(&#x2550;O)NHR(in which R, R, and Rmay each independently be selected from C-Calkyl and C-Caryl), Rmay be C-Calkyl, and Rmay be selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, a benzyl group, a C-Calkyl-substituted benzyl group, and a naphthylmethyl group.

Electronic device using anisotropic conductive composition and film

A semiconductor device may include: a substrate. First and second gate electrode patterns are disposed on first and second fin type active patterns. The first and second fin type active patterns include a first channel region disposed between a first impurity region and a second impurity region. The second gate electrode pattern crosses a first gate-separating region included in the second fin type active region. The first gate-separating region includes a trench and an embedded insulator filling at least a portion of the trench.

Non-volatile memory with improved sensing window

An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa&#xb7;s to about 10,000 Pa&#xb7;s at about 30&#xb0; C. to about 200&#xb0; C.

Anisotropic conductive film and apparatus including the same

An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles.

Anisotropic conductive film and electronic device including the same

An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: 

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Hyun Min Choi