Wacker Chemie Ag

Hyun-Kwan Yang

Arvid Kuhn

Young-Hyuk Joo

Frank Sandmeyer

Young-jin Kim

A curable organopolysiloxane composition, a Light Emitting Diode (LED) encapsulant and a semiconductor device, employ a curable organopolysiloxane composition containing a branched organopolysiloxane bearing alkenyl groups and aryl groups, a linear organopolysiloxnae bearing terminal Si&#x2014;H functionality, and a low molecular weight component having at least one alkenyl group. As an encapsulant, the composition displays improved stability.

Curable organopolysiloxane composition, encapsulant and semiconductor device

Unique compositions containing organopolysiloxanes having both silicon-bonded hydrogen and aliphatically unsaturated groups exhibit robust processing characteristics and provide coatings or encapsulations of high transparency which can withstand numerous temperature cycles without failure.

Siloxane resin compositions

Addition curable silicone resin compositions have excellent processing characteristics, and can be used to encapsulate electrical and electronic devices.

Growing community of inventors

Yongin-si, South Korea

Hyun-Kwan Yang