Hyundai Motor Company

Kia Corporation

Kia Motors Corporation

Samsung Display Co., Ltd.

Hyun Koo Lee

Myung Ill You

Jun Hee Park

Hyeon Uk Kim

Woo Yong Jeon

Sang Cheol Shin

Ki Young Jang

Sung Won Park

Sung Min Park

Soo Young Kim

Young Nam Yun

Kang Ho Jeong

Kyu Seok Kim

Min Tak Lee

Nam Sik Kong

A power module may include: a positive terminal connected to a positive pole of a battery; a negative terminal connected to a negative pole of the battery; an output terminal connected to a winding among multiple windings included in a motor; a changeover terminal connected to a neutral point regarding the multiple windings; a top switch connected between the positive terminal and the output terminal; a bottom switch connected between the negative terminal and the output terminal; and a changeover switch connected to the changeover terminal and configured to form a common node with at least one of the top switch or the bottom switch.

Power module

A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electrically connecting at least two among the chip, the upper substrate and the lower substrate to transmit an electrical signal, and an insulating portion positioned between the plurality of metal portions and insulating the metal portions.

Power module and manufacturing method thereof

A motor driving apparatus includes a motor including windings respectively corresponding to a plurality of phases, a first inverter including at least one first power module and providing an AC voltage corresponding to each of the phases to one end of the windings, a second inverter including a plurality of second power modules each including a changeover switch and providing the AC voltage corresponding to each of the phases to the other end of the windings based on information indicating whether the changeover switch is turned on, and a controller connected to the changeover switch and configured to control whether the changeover switch is turned on according to a motor driving mode, wherein each of the second power modules has a changeover terminal to which a first end of the changeover switch is connected, and the changeover terminals of the plurality of second power modules are short-circuited to each other.

Motor driving apparatus

An embodiment provides a power module that includes a first substrate comprising first material, a plurality of first switching elements on the first substrate, a second substrate comprising second material having a lower thermal conductivity than the first material, a plurality of second switching elements and a third switching element on the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

Power module and motor drive system using the same

A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

Power module and method of manufacturing the same

A power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.

Power module for vehicle and motor driving apparatus including the same

An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Motor drive device

A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.

Soldering structure with groove portion and power module comprising the same

Disclosed is a power module capable of maximizing heat dissipation performance through application of a thick lead frame and a ceramic coating layer to upper and lower sides of a semiconductor device.

Power module having heat dissipation structure

A power module includes a substrate having a dielectric layer, a first power semiconductor device disposed on an upper part of the substrate, and a second power semiconductor device disposed on a lower part of the substrate.

Power module and method of manufacturing same

A mura detection device includes an XYZ coordinate system conversion unit which receives a photographed image of a display device and converts the photographed image into XYZ image data according to XYZ chromatic coordinates, a background image generation unit which generates background image data obtained by removing a part of the XYZ image data, a color difference calculation unit which generates color difference image data by comparing the photographed image and the background image data, and a mura data generation unit which calculates a color mura index value using the color difference image data.

Mura detection device and method of detecting mura using the same

A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.

Hybrid-type power module having dual-sided cooling

Disclosed herein are a double-side cooling type power module and a producing method thereof. The double-side cooling type power module includes a pair of semiconductor chips disposed between an upper substrate and a lower substrate. The double-side cooling type power module includes output terminal leads configured to be disposed on a lower surface of the upper substrate and each connected to the pair of semiconductor chips, respectively; a plus terminal lead configured to be disposed at one side of an upper surface of the lower substrate to be connected to any one semiconductor chip selected from the pair of semiconductor chips; and a minus terminal lead configured to be disposed at the other side of the upper surface of the lower substrate to be connected to the other semiconductor chip of the pair of semiconductor chips.

Double-side cooling type power module and producing method thereof

An input terminal of a power module of double-side cooling includes: a plus plate which is divided into a plurality of first terminal areas coupled with any one or more of the plurality of semiconductor chips and is connected with an anode of a battery, wherein a first bridge area connects the plurality of first terminal areas with each other; a minus plate which is divided into a plurality of second terminal areas coupled with any one or more of the plurality of semiconductor chips which are not coupled with the plus plate and is connected with a cathode of the battery, wherein a second bridge area connects the plurality of second terminal areas with each other and is disposed adjacent to the first bridge area; and a separator which is made of an insulation material and disposed between the plus plate and the minus plate.

Growing community of inventors

Seoul, South Korea

Hyun Koo Lee