Samsung Electronics Co., Ltd.

Hyun-Ki Kim

Sang-Soo Kim

Yong-Woo Lee

Sang-Min Lee

Seung-Hwan Kim

Tae-Hyung Rhee

Dae-Young Choi

Mi-Yeon Kim

Jae-Wan Kim

Jung-Hee Kim

Hyun-Ki Jung

Jae-Min Moon

Woo-Hyuk Jang

Han-Shin Youn

Jun-young Oh

Jong-Youl Kim

Seong-hyun Jang

Moon-Koog Song

Yong-Kwan Lee

A lower package includes a semiconductor chip. A first upper package and a second upper package are disposed on the lower package. A heat spreader is disposed on the lower package. The heat spreader includes an upper plate and an extension part connected to the upper plate. At least a part of each of the first and second upper packages vertically overlaps the semiconductor chip. The upper plate may be arranged on the first upper package and the second upper package. The extension part may be arranged between the first upper package and the second upper package. The extension part has a vertical height that is greater than its horizontal width.

Semiconductor package having heat spreader and method of forming the same

Provided are a printed circuit board (PCB) and a semiconductor package including the same. The PCB includes a core layer having a stacked structure including at least a first layer made of a first material that has a first coefficient of thermal expansion (CTE) and a second layer made of a second material that has a second CTE different from the first CTE, an upper wiring layer disposed on a first surface of the core layer, and a lower wiring layer disposed on a second surface of the core layer opposite the first surface.

Printed circuit board having different sub-core layers and semicondutor package comprising the same

Provided are a stack semiconductor package manufactured by multiple molding that can prevent the breakage due to stress concentration at a connecting portion between separate semiconductor packages and a method of manufacturing the same. The stacked semiconductor packages are combined together through sealing resins by molding them multiple times, resulting in uniform stress distribution across substantially the entire interface between the semiconductor packages.

Stack semiconductor package formed by multiple molding and method of manufacturing the same

A semiconductor chip package with a lead frame having a plurality of leads formed along four sides of the lead frame and tie bars extending from an edge of each of the four sides, wherein bottom surfaces of the tie bars are recessed, a semiconductor chip which is adhered to the recessed surfaces of the tie bars, connectors which electrically connect a plurality of chip pads formed on an upper surface of the semiconductor chip with the plurality of leads, and an encapsulant which encapsulates the upper surface of the semiconductor chip, the connector and bonding portions of the connector.

Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package

This invention provides an optical fiber block that includes an optical-fiber-alignment portion and a stress-reduction-depth portion. In the optical-fiber-alignment portion, a V groove array is arranged to accommodate the non-coated fiber portion of a ribbon fiber. The V groove array is formed by primary and secondary wet-etching processes on a silicon wafer, and further includes first V grooves at both sides and second V grooves different from the first V grooves disposed between the first V grooves. Meanwhile, the stress-reduction-depth portion is formed by another wet etching, extending to a predetermined depth from the optical-fiber-alignment portion, for reducing stress caused by a variation in the coating thickness of the optical fibers.

Optical fiber block

A thermo-optic switch using a small drive power while exhibiting a reduction in the coupling loss caused by the coupling to optical fibers and a switch speed of several hundred microseconds or less. A method for manufacturing the thermo-optic switch and a method for changing an optical line switching using the thermo-optic switch are also disclosed. The thermo-optic switch includes a substrate having etched portions at regions respectively corresponding to input and output terminals of the thermo-optic switch, a lower clad layer formed over the substrate, the lower clad layer having an input taper formed at the region corresponding to the input terminal and adapted to convert a circular mode, input from an optical fiber connected to the input terminal, into an oval mode having a rib shape, and an output taper formed at the region corresponding to the output terminal and adapted to convert the oval mode into a circular mode allowed to be input to an optical fiber connected to the output terminal, a core layer formed over the lower clad layer and provided with branched waveguides having a rib structure, the branched waveguides selectively receiving the oval mode from the input taper and outputting the received oval mode to the output taper, an upper clad layer formed over the core layer, and switching electrodes formed on the upper clad layer and selectively activated to apply heat to an associated one of the branched waveguides in such a fashion that an effective refractive index difference occurs between the branched waveguides, thereby causing the branched waveguides to selectively receive the oval mode from the input taper.

Method for manufacturing the thermo-optic switch, and method for changing optical line using the thermo-optic switch

Growing community of inventors

Cheonan-si, South Korea

Hyun-Ki Kim