Samsung Electronics Co., Ltd.

Hyun-Jung Song

Hyun-jin Kim

Ji-yeon Kwak

Min-Kyu Park

Kyung-a Kang

Ju-youn Lee

Joon-Kyu Seo

Sung-Sik Yoo

Dong-Seok Ryu

Jung-Hwan Kim

Sun-Pil Youn

Chung-Sun Lee

Hye-young Jang

Sangwon Kim

Sang-Won Kim

Hyun-Jin Kim

Won-keun Kim

Kwang-Chul Choi

Eun-Kyoung Choi

Eun-young Choi

Cha-Jea Jo

Tae-Hong Min

Ju-Youn Lee

Ji-seok Hong

Tae-Hong Kim

Ji-Seok Hong

Kyung-A Kang

Ji-Yeon Kwak

A method of controlling a portable device including first and second touch screens is provided. The method includes displaying first information related to a first application on the first touch screen and displaying second information related to the first application on the second touch screen; receiving a first user input moving to the first touch screen on the second touch screen; and replacing the first information and the second information with a third information and a fourth information related to the first application on the first and second touch screens, in response to receiving the first user input, wherein each of the third information and the fourth information is displayed while being slidden from the second touch screen to the first touch screen and the third information is displayed over a boundary between the first and second screens during the sliding of the third and fourth information.

Portable device comprising a touch-screen display, and method for controlling same

A controlling a portable device comprising a first touch screen and a second touch screen is provided. The method includes displaying first information related to a first application on the first touch screen and displaying second information related to the first application on the second touch screen; receiving a first user input moving to the first touch screen on the second touch screen; and replacing the first information and the second information with a third information and a fourth information related to the first application on the first touch screen and the second touch screen, in response to receiving the first user input, wherein each of the third information and the fourth information is displayed while being slidden in direction from the second touch screen to the first touch screen and the third information is displayed over a boundary between the first touch screen and the second screen during the sliding of the third information and the fourth information.

A method of controlling a portable device including at least one foldable panel and first and second touch screens is provided. The method includes displaying, on the first touch screen, a first page designated as a home screen and an icon related to at least one application, and a dock area, and displaying, on the second touch screen, first information in a state where the foldable panel is unfolded. The method also includes replacing the first page and the dock area with an outgoing call screen, receiving a phone number input, replacing the outgoing call screen with a dialing screen, and displaying, on the second touch screen, a guide message indicating to fold the portable device for a call. The method also includes replacing the dialing screen with a mid-call screen, and removing the guide message displayed on the second touch screen, and displaying the first information.

A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip. The molding material may be on outer side surfaces of the homogeneous integral underfill material above the upper surface of the first chip, wherein, in view of a first cross sectional profile, the molding material is separated from sidewalls of the second chip by the homogeneous integral underfill material such that the molding material does not contact sidewalls of the second chip.

Semiconductor chip stack having improved encapsulation

A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.

Semiconductor package and method of manufacturing the semiconductor package

A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

Semiconductor package and method of manufacturing the same

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Seoul, South Korea

Hyun-Jung Song