Samsung Electro-mechanics Co., Ltd.

Hyun Ju Jung

Sung Jin Park

So Young Jun

Jeong Hwan Im

Young Sang Ha

Tae Ryung Hu

Young Jin Ha

A coil component includes: a body; a coil portion disposed in the body and including a lead-out pattern exposed on one end surface of the body; an insulating layer disposed on the one end surface of the body and having an opening disposed on the lead-out pattern; an external electrode including a connection portion, disposed to be in contact with the lead-out pattern, and a pad portion extending from the connection portion to one surface of the body; and a cover insulating layer disposed on the one end surface of the body to cover the connection portion. The connection portion is spaced apart from all corner portions of the one end surface of the body, except for a corner portion between the one end surface of the body and one surface of the body, on the one end surface of the body.

Coil component

A coil component includes a body; a coil portion disposed in the body and including a lead-out pattern; an external electrode disposed on a first surface of the body; and a plurality of connection vias disposed in the body, connecting the external electrode to the lead-out pattern, and integrated with each other, wherein, in each of the plurality of connection vias, a size of an end surface area of a lower portion adjacent to the external electrode is different from a size of an end surface area of an upper portion adjacent to the lead-out pattern.

A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.

Multilayer chip bead

A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.

Growing community of inventors

Yongin-si, South Korea

Hyun Ju Jung