Samsung Electronics Co., Ltd.

Hyun-joon Park

Min Gyu Kim

Hoon Bae Kim

Tae-gon Kim

Hyun-hee Lee

Yong-Sung Hong

Seung-yong Oh

Jong-Yoon Park

A conveyor apparatus is provided. The conveyor apparatus includes a rail formed in a closed curve line, a chain conveyor that moves along the rail, a driver that drives the chain conveyor, and a first and a second variable conveyors that relatively vary lengths of at least two portions of the chain conveyor so that a section of the chain conveyor remains in position while other portions of the chain conveyor moving along the rail.

Conveyor apparatus

A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.

Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same

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Suwon-si, South Korea

Hyun-joon Park