Cheil Industries Inc.

Hyun Joo Seo

Young Ju Shin

Kyoung Hun Shin

Kang Bae Yoon

Woo Jun Lim

Kyu Bong Kim

Kyoung Soo Park

Hyun Hee Namkung

Do Hyun Park

Bong Yong Kim

Sang Sik Bae

Cheon Seok Lee

Byeong Hwan Jeon

Kyong Hun Shin

Young Jin Kwon

A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.

Semiconductor device connected by anisotropic conductive film

A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

Semiconductor device connected by anisotropic conductive adhesive film

A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa&#xb7;s at 80&#xb0; C.

Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device

A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40&#xb0; C. after curing of the film, and a peak point of 80&#xb0; C. to 90&#xb0; C. in a DSC (Differential Scanning calorimeter) profile of the film.

A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.

Composition for circuit connection film and circuit connection film using the same

An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.

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Uiwang-si, South Korea

Hyun Joo Seo