Samsung Electronics Co., Ltd.

Electronics and Telecommunications Research Institute

Industry-University Cooperation Foundation Hanyang University

Hyun-Jong Oh

Dong-Woo Shin

Seong-Chan Han

Yong-Hyun Kim

Chang-Yong Park

Kwang-Ho Chun

Nam-Yong Oh

Sun-young Lee

Jin-Woong Kim

Kyu-Heon Kim

Euee-Seon Jang

Sung-Won Park

Dong-chun Lee

Wook-Joong Kim

Hun Taek Han

Jong-Woo Won

Myung-Seok Ki

Kyung-du Kim

Sun-Kyu Hwang

Jin-Kyu Yang

Chan-Hyung Yun

A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.

Router apparatus

A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Semiconductor packaging device

A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.

Semiconductor module

A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

Heat sink for dissipating heat and apparatus having the same

Disclosed are a system and method for encoding and decoding an image. The image compression system includes an image segmentation unit () for segmenting a first image into a plurality of sub-images; a first encoding unit () for encoding the sub-images to output sub-image bitstreams; a BMAP construction unit () for calculating the quantity of information of each sub-image bitstream and generating BMAP information using the calculated quantity of information and information on construction of each sub-image; and a bitstream combining unit () for combining the sub-image bitstreams and BMAP information.

System and method for encoding and decoding an image using bitstream map and recording medium thereof

Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.

Heat sink and memory module using the same

A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Heat spreader, semiconductor package module and memory module having the heat spreader

Growing community of inventors

Seoul, South Korea

Hyun-Jong Oh