Samsung Electronics Co., Ltd.

Hyun-jeong Roh

Tae-Joong Song

Ha-Young Kim

Dal-Hee Lee

Sung-We Cho

Chang-beom Kim

An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.

Integrated circuit including interconnection and method of fabricating the same, the interconnection including a pattern shaped for mitigating electromigration

Integrated circuit including interconnection and method of fabricating the same, the interconnection including a pattern shaped and/or a via disposed for mitigating electromigration

Growing community of inventors

Suwon-si, South Korea

Hyun-jeong Roh