Samsung Electro-Mechanics Co., Ltd.

Lg Display Co., Ltd.

Hyun Ho Shin

Seung Mo Lim

No Il Park

Dong Sik Yoo

Jeong Hoon Ryou

Hee Sung Choi

Woong Do Jung

Ha Yong Jung

Jung Tae Park

Il Ro Lee

Sung Han Won

Jae Youn Jeong

Seoung Jae Lee

Yeoung Jin Lee

Ki Duk Kim

Seung Hun Han

Byeong Cheol Moon

Sang Jong Lee

Tae Joon Park

Yun Sung Kang

Hong Kyu Shin

Byung Hun Kim

In Young Kang

Kyo Yeol Lee

Young Seok Yoon

Chang Soo Jang

Won Chul Sim

Hyung Ki Hong

Su Bong Jang

Ju Ho Kim

Hai Joon Lee

Sang Kee Yoon

Youn Soo Kim

Jae Chang Lee

Sung Sun Kim

Sung Min Cho

Seung Heon Han

Hong Joo Lee

Dong Joon Oh

Tae Young Choi

Ho Phil Jung

Yun Hee Kim

Sung Yeol Park

Hyun Sub Oh

Young Kyu Park

Pil Joong Kang

Jong Beom Kim

Chang Jo Yu

Sung Min Jung

Young June Lee

Jae Jun Park

Jong Suk Han

Jae Kyeong Yun

Na Rae Park

Seon Uk Hwang

Juun Park

A tantalum capacitor includes a capacitor body comprising a tantalum body having a tantalum wire and a molded portion; an anodic terminal connected to the tantalum wire and disposed on the first surface of the capacitor body; an anodic connection portion connected to the anodic terminal and disposed on the fifth surface of the capacitor body; a cathodic terminal connected to the tantalum body and disposed on the second surface of the capacitor body; a cathodic connection portion connected to the cathodic terminal and spaced apart from the anodic connection portion on the fifth surface of the capacitor body; and a substrate disposed on the sixth surface of the body and on which the tantalum body is mounted, wherein the anodic terminal and the cathodic terminal are electrically isolated on the substrate.

Tantalum capacitor having a substrate spaced apart from a mounting surface

A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

Tantalum capacitor

A capacitor includes a structure including a plurality of openings penetrating from a first surface of the structure to a second surface opposing the first surface; a capacitor layer disposed on the second surface of the structure and in the plurality of the openings and including a dielectric layer, and a first electrode and a second electrode, the dielectric layer interposed between the first electrode and the second electrode; a first connection layer disposed on the first surface of the structure and connected to the first electrode; a second connection layer disposed on the capacitor layer on the second surface and connected to the second electrode of the structure; and first and second terminals disposed on opposite side surfaces of the structure and connected to the first connection layer and the second connection layer, respectively.

Capacitor and method of manufacturing the same

A capacitor component includes a porous body, a first electrode layer covering surfaces of pores of the porous body, a dielectric layer covering the first electrode layer, and a second electrode layer filling the pores of the porous body and covering the dielectric layer.

Capacitor component

A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.

Thin-film ceramic capacitor having capacitance forming portions separated by separation slit

A capacitor includes a support member included in a body, a plurality of pillars disposed in an upper portion of the support member and each having a lower portion wider than an upper portion, and a capacitor layer disposed on a side surface and an upper surface of each pillar and including a dielectric layer and first and second electrodes alternately disposed with the dielectric layer interposed therebetween. Lower end portions of adjacent pillars are in contact with each other.

Capacitor and board having the same

A capacitor includes a body including a substrate and a capacitance layer disposed on the substrate. The substrate includes a plurality of first trenches penetrating from one surface of the substrate to an interior of the substrate, and a first capacitor layer disposed on the one surface of the substrate and in the first trenches. The first capacitor layer includes a first dielectric layer and first and second electrodes disposed on opposing sides thereof. The capacitance layer includes a plurality of second trenches penetrating from one surface of the capacitance layer to an interior of the capacitance layer, and a second capacitor layer disposed on the one surface of the capacitance layer and in the second trenches. The second capacitor layer includes a second dielectric layer and third and fourth electrodes disposed on opposing sides thereof. A method of manufacturing the capacitor is also provided.

A multilayer thin-film capacitor includes a multilayer body in which a plurality of dielectric layers and first and second internal electrode layers are alternately stacked, and first and second external electrodes are disposed on the multilayer body and connected to the first and second internal electrode layers, respectively. The multilayer thin-film capacitor may include a first edge via connected to the external electrode and disposed at or adjacent at least one edge of an upper surface of the multilayer body, and a second edge via connected to the second external electrode and disposed at or adjacent at least one edge of the upper surface of the multilayer body.

Multilayer thin-film capacitor

A thin film capacitor includes: a body formed by alternately stacking first and second electrode layers, with dielectric layers therebetween on a substrate. A plurality of first vias are disposed in the body and electrically connected to the first electrode layers. A plurality of second vias are disposed in the body, electrically connected to the second electrode layers, and disposed alternately with the first vias. A first connection electrode is disposed on an upper surface of the body and connected to the plurality of first vias, a second connection electrode is disposed on the upper surface of the body and connected to the plurality of second vias, and first and second electrode pads are disposed on the first and second connection electrodes, respectively, and formed to not overlap the plurality of first and second vias.

Thin film capacitor and method of manufacturing the same

A capacitor includes a plurality of cells each including a capacitance formation portion in which a plurality of trenches are positioned and a margin portion disposed around the capacitance formation portion. The cell includes three or more dielectric layers disposed in the capacitance formation portion and extending in the trenches, and three or more electrode layers sequentially stacked with dielectric layers interposed therebetween and extending in the trenches. At least first and second electrode layers have opposite polarities and each include a lead electrode extending from the capacitance formation portion to the margin portion. A lead electrode of the first electrode layer is disposed in a first region disposed to one side of a central portion of a cell, and a lead electrode of the second electrode layer is disposed in a second region disposed on another side of a central portion of the cell.

Capacitor

A thin-film capacitor includes a body in which a plurality of dielectric layers and first and second electrode layers are alternately stacked on a substrate, first and second electrode pads are on external surfaces of the body, and a plurality of vias are within the body. Among the plurality of vias, a first via connects the first electrode layer and the first electrode pad, and a second via connects the second electrode layer and the second electrode pad. The first via and the second via are units each include a plurality of vias, and the first via unit and the second via unit are alternately disposed on an upper surface of the body.

Thin-film capacitor having vias connected to respective electrode layers

A thin-film capacitor includes a body having a plurality of dielectric layers and first and second electrode layers alternately stacked on a substrate, first and second electrode pads disposed on one surface of the body, a plurality of vias having a multistage shape being disposed in the body, a first via of the plurality of vias connects the first electrode layer to the first electrode pad, and penetrates from the surface of the body to a first lowermost electrode layer adjacent the substrate, a second via of the plurality of vias connects the second electrode layer to the second electrode pad, and penetrates from the surface of the body to a second lowermost electrode layer adjacent the substrate and an upper surface of the first electrode layer is exposed in the first via, and an upper surface of the second electrode layer is exposed in the second via.

Thin-film capacitor

A thin-film capacitor includes a body in which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate and first and second electrode pads disposed on external surfaces of the body, wherein a plurality of vias are disposed within the body, and the plurality of vias includes a first via electronically connects the first electrode layer and the first electrode pad and penetrates through from one surface of the body to a lowermost first electrode layer adjacent to the substrate; and a second via electronically connects the second electrode layer and the second electrode pad and penetrates through from one surface of the body to a lowermost second electrode layer adjacent to the substrate. The plurality of vias has a multi-stage shape, and a top view of each of the plurality of vias is asymmetric in shape.

Thin-film capacitor having asymmetric shaped vias

A multilayer thin-film capacitor includes a first multilayer body and a second multilayer body spaced apart from each other in a vertical direction by a split layer. The second multilayer body is disposed on a lower surface of the first multilayer body, the first multilayer body constitutes a top capacitor, and the second body constitutes a bottom capacitor. First, second, and third external terminals may be disposed on an upper surface of the first multilayer body and be connected to internal electrode layers of the first and second multilayer bodies.

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Suwon-si, South Korea

Hyun Ho Shin