Cheil Industries Inc.

Hyun Hee Namkung

Dong Seon Uh

Jae Sun Han

Kwang Jin Jung

Kyoung Soo Park

Kang Bae Yoon

Hyun Wook Kim

Jin Young Seo

Hyun Joo Seo

Cheon Seok Lee

Bong Yong Kim

Byeong Hwan Jeon

Kyoung Hun Shin

Jin Seong Park

Sang Sik Bae

Kyung Il Sul

Kyong Hun Shin

Young Jin Kwon

A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/&#xb0; C. or less at about 100&#xb0; C. or less.

Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film

An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1:Connection resistance increment (%)=|()/|&#xd7;100&#x2003;&#x2003;(Expression 1)where A is a connection resistance measured after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85&#xb0; C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.

An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.

Optical member comprising anisotropic conductive film

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.

Anisotropic conductive film and semiconductor device

A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.

Composition for circuit connection film and circuit connection film using the same

An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.

Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods

An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.

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Uiwang-si, South Korea

Hyun Hee Namkung