Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Hyun Hee Gu

Myung Jun Park

Jong Ho Lee

Hye Young Choi

Jang Yeol Lee

Byung Jun Jeon

Chang Hoon Kim

Kyu Ha Lee

Eui Hyun Jo

Ji Hong Jo

Jae Hyun Lee

Jae Yeol Choi

Yoo Jeong Lee

Sang Hoon Kwon

Jin Soo Park

Da Young Choi

Bum Su Kim

Jae Young Park

Jin Woo Lee

Kyung Pyo Hong

Byoung Jin Chun

Hye Min Bang

Bum Soo Kim

Duk Hyun Chun

Yeon Song Kang

Gun Jung Yoon

Hee Sang Kang

Jin Su Park

Chung Eun Lee

Woo Kyung Sung

Jae Hwan Han

Sung Koo Kang

Su Youn You

Young Ghyu Ahn

Byoung Hwa Lee

Ki Hwan Kim

Doo Young Kim

Hae Suk Chung

Jeong Ryeol Kim

Eun Jin Kim

Eun Hyuk Chae

Chul Seung Lee

Chung Yeol Lee

Jin Hyung Lim

Eun Sang Na

Jun Hyeong Kim

Ji Hee Moon

Sung Bum Sohn

Young Sook Lee

Byung Woo Jeon

Kang Ha Lee

Hye Jin Jeong

Hye Seong Kim

Youn Sik Jin

Seung Hee Yoo

Eun Joo Choi

Byong Gyun Kim

Ha Jeong Kim

Tae Jin Jang

Sun Woong Kim

Yoon A Park

Byoung-Jin Chun

Ji Sook Kim

Chang Joo Lee

A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface, and extending onto a portion of each of the third to sixth surfaces; a second external electrode disposed on the second surface, and extending onto a portion of each of the third to sixth surfaces, wherein, in at least one of cross-sections in first and second directions or in first and third directions, in at least one of the first and second external electrodes, a maximum thickness in a peripheral portion of the first and second surfaces is greater than a maximum thickness in a center portion, and a maximum thickness in a center portion is greater than a maximum thickness in a corner portion.

Ceramic electronic component

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in a third direction, first and second external electrodes including first and second plating layers disposed on the third and fourth surfaces, respectively and first and second electrode layers disposed on the first and second plating layers, respectively, first and second band electrodes disposed on the first surface and connected to the first and second external electrode, respectively. The first and second electrode layers do not contain glass.

Multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.

A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.

Capacitor component

A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and an external electrode formed outside the ceramic body. The external electrode includes an electrode layer, and a thickness Tof the electrode layer corresponding to a central region of the ceramic body in a thickness direction is 5 &#x3bc;m or more and 30 &#x3bc;m or less, a thickness Tof the electrode layer corresponding to a region in which an outermost internal electrode is located is 5 &#x3bc;m or more and 15 &#x3bc;m or less, and a thickness Tof the electrode layer corresponding to a corner portion of the ceramic body is 0.1 &#x3bc;m or more and 10 &#x3bc;m or less.

Multi-layered ceramic electronic component

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba&#x2014;Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.

Multilayer ceramic electronic component and board for mounting of the same

A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 &#x3bc;m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.

A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.

Multilayer electronic component and manufacturing method thereof

A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.

Multilayer ceramic electronic component and manufacturing method thereof

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Suwon-si, South Korea

Hyun Hee Gu