Korea Institute of Science and Technology

Techwing Co., Ltd.

Hyun Cheol Song

Ji Won Choi

Chong Yun Kang

Jin Sang Kim

Seung Hyub Baek

Dong Hyun Yo

Seok Jin Yoon

Yun Sung Na

In Gu Jeon

Young Ho Do

Sang Tae Kim

Seong Keun Kim

Christopher W Bielawski

Jung Hwan Yum

Woo Chui Lee

Eric S Larsen

Provided is a dielectric layer that has a rock salt structure in a room temperature stable phase. The dielectric layer is made of a compound having a chemical formula of BeMO, where M includes one of alkaline earth metals and x has a value greater than 0 and not greater than 0.19. A semiconductor memory device also is provided that includes a capacitor composed of a lower electrode; a dielectric layer disposed on the lower electrode; and an upper electrode disposed on the dielectric layer, wherein the dielectric layer has a rocksalt structure in a room temperature stable phase and is made of a compound having a chemical formula shown below,BeMO,

Dielectric layer and a semiconductor memory device including the dielectric layer as a capacitor dielectric layer

Provided are a method of manufacturing a flexible piezoelectric energy harvesting device using a piezoelectric composite, and a flexible piezoelectric energy harvesting device manufactured by the same. The method of manufacturing the flexible piezoelectric energy harvesting device includes: forming a first electrode layer on a first flexible substrate; spin-coating a piezoelectric composite layer on the first electrode layer, wherein the piezoelectric composite layer is produced by mixing piezoelectric powder with polymer; performing heat treatment on the piezoelectric composite layer to harden the piezoelectric composite layer; and bonding a second flexible substrate with a second electrode layer on the hardened piezoelectric composite layer. Therefore, it is possible to simplify a manufacturing process and manufacture a high-performance flexible piezoelectric energy harvesting device having various sizes and patterns.

Method of manufacturing flexible piezoelectric energy harvesting device

Provided is a method of fabricating an oxide thin film device using laser lift-off and an oxide thin film device fabricated by the same. The method includes: forming an oxide thin film on a growth substrate; bonding a temporary substrate on the oxide thin film; irradiating laser onto the growth substrate to separate the oxide thin film on which the temporary substrate has been bonded from the growth substrate; bonding a device substrate on the oxide thin film on which the temporary substrate has been bonded; and forming an upper electrode film on the oxide thin film. Therefore, it is possible to overcome problems caused by a defective layer by transferring an oxide thin film transferred on a polymer-based temporary substrate onto a device substrate, without using an interface on which a defective layer formed due to oxygen diffusion upon laser lift-off is formed.

Method of fabricating oxide thin film device using laser lift-off and oxide thin film device fabricated by the same

A pick-and-place module for test handlers includes a main body, and a kit. The main body has N-th vacuum paths (where N is plural). The kit has M-th pickers. The M-th pickers are provided so as respectively correspond to M-th vacuum passages (where 1&#x2266;M&#x2266;N), which are formed to respectively correspond to all or some of the N-th vacuum paths formed in the main body, and holds semiconductor devices or releasing the held semiconductor devices using vacuum pressures. The kit is detachably mounted to the main body.

Pick-and-place module for test handlers

Operation methods of test handler are disclosed. The pick-and-place apparatus picks up semiconductor devices from first loading compartments arrayed in a matrix on a first loading element, moves, and places onto second loading compartments arrayed in a matrix on a second loading element. Pickers of the pick-and-place apparatus pick up the semiconductor devices from the first loading compartments and place them selectively onto a plurality of adjacent odd rows or a plurality of adjacent even rows of the second loading compartments during one operation. The pick-and-place apparatus includes a relatively large number of the pickers, preferably arrayed in a matrix, and thus performs loading and unloading of semiconductor devices at a relatively high speed.

Operating method of test handler

Growing community of inventors

Seoul, South Korea

Hyun Cheol Song