Corning Precision Materials Co., Ltd.

Samsung Corning Precision Materials Co., Ltd.

Hyun Bin Kim

Yung-Jin Jung

Yong Choi

Chang Gyu Kim

Seulgi Bae

Gun Sang Yoon

Jee Yun Cha

Yongwon Choi

June Hyoung Park

Sang-Ryoun Ryu

Sung Hoon Lee

Dong-Gun Moon

Young Soo Jung

Hyun Hang Park

Bo Gyeong Kim

The present invention relates to an integrated circuit package substrate and, more specifically, to an integrated circuit package substrate, which exhibits excellent conductivity and reliability through the improvement of an adhesive force between a metal line for electrically connecting an upper part and a lower part of the integrated circuit package substrate and glass formed inside the integrated circuit package substrate. To this end, the present invention provides the integrated circuit package substrate comprising: a core part made of glass; a first metal thin plate formed on the upper part of the core part and made of Cu; a second metal thin plate formed at the lower part of the core part and made of Cu; a metal line formed in a shape in which the metal line penetrates through the first metal thin plate, the core part, and the second metal thin plate so as to electrically connect the first metal thin plate and the second metal thin plate, and made of Cu; and an intermediate layer formed on the outer circumferential surface of the metal line, wherein the intermediate layer includes any one of CuO, CuO doped with a transition metal, and a metal oxide including Cu and a transition metal.

Integrated circuit package substrate

A method of manufacturing a thermochromic substrate, with which transmittance can be increased. The method includes the steps of forming a first thin film as a coating on a base substrate, the refractive index of the first thin film being different from that of a VOthin film; forming a pre-thermochromic thin film by coating the first thin film with pure vanadium; forming a second thin film as a coating on the pre-thermochromic thin film, the refractive index of the second thin film being different from that of a VOthin film; and heat-treating a resultant stack that includes the base substrate, the first thin film, the pre-thermochromic thin film and the second thin film.

Method of manufacturing thermochromic substrate

A method of fabricating a light-scattering substrate, a light-scattering substrate fabricated by the same method, and an organic light-emitting device (OLED) including the same light-scattering substrate, in which a light-scattering layer of the light-scattering substrate can improve a light extraction efficiency. The method fabricates the light-scattering substrate by chemical vapor deposition, and includes loading a base substrate into a chamber, and forming a light-scattering layer on the base substrate by supplying a Ti source and an oxidizer including HO into the chamber. In the process of forming the light-scattering layer, the mole ratio of the HO with respect to the Ti is 10 or greater.

Method of fabricating light-scattering substrate

A thermochromic window, the sunlight transmittance of which is adjustable depending on temperature, and a method of fabricating the same. The thermochromic window includes a substrate, a plurality of nanodots formed on the substrate, and a thermochromic thin film coating the substrate and the nanodots. The thermochromic thin film is made of a thermochromic material. The thickness of the thermochromic thin film disposed on the substrate is smaller than the thickness of the thermochromic thin film disposed on the nanodots.

Thermochromic window and method of fabricating the same

A thermochromic window that can effectively insulate heat when warming is conducted in winter. The thermochromic window that includes a substrate, a thermochromic thin film formed on the substrate, and a transparent conductive film formed on at least one surface of the upper surface and the undersurface of the thermochromic thin film. The emissivity of the transparent conductive film is lower than the emissivity of the thermochromic thin film.

Thermochromic window

Growing community of inventors

Asan-si, South Korea

Hyun Bin Kim