Lg Innotek Co., Ltd.

Industry-university Cooperation Foundation Hanyang University

Hyun Aee Chun

Hyuk Soo Lee

Sung Won Lee

Sung Wuk Ryu

Jae Bong Choi

Yang Kyoo Han

Moon Ki Kim

Sai Ran Eom

Bo Ra Hong

Gyoung Pyo Kong

The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof

The present disclosure relates to a transparent polyarylene ether polymer with high heat resistance and a method for preparing the same. More particularly, the present disclosure relates to a polyarylene ether polymer and a method for preparing the same, wherein the polyarylene ether polymer has a repeating structure in which cardo-type aromatic diols having a large molecular volume, polyether sulfones which are amorphous polymers having a high glass transition temperature and superior film formability, and polyether ketones which are crystalline polymers having superior heat resistance and mechanical properties are sequentially arranged. The polyarylene ether polymer is both transparent and heat resistant and, thus, can be used, for example, for a flexible plastic substrate.

Transparent polyarylene ether polymer with high heat resistance and method for preparing the same

Growing community of inventors

Gyeonggi-do, South Korea

Hyun Aee Chun