Samsung Electronics Co., Ltd.

Hyun-ae Lee

Kwang-Soo Park

Jong-hoon Kim

Jin-ho So

Hoon-Jung Kim

Dong-Dae Kim

A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.

Probe card including a sub-plate with a main supporter and a sub-supporter with the sub-supporter having probe needles

Example embodiments provide for an apparatus for testing various kinds of semiconductor devices having different distances between probes. Example embodiments also provide for a method of fabricating and using said apparatus. In accordance with example embodiments, an apparatus for testing a semiconductor device may include at least one cable penetrating a plate and extending from a surface of the plate. The at least one cable may include at least one signal line and at least one ground line. The apparatus may also include a pair of probes connected to the at least one signal line and configured to contact a first pad of a semiconductor device and a second pad of the semiconductor device. In accordance with example embodiments, the apparatus for testing a semiconductor device may also include a control unit on the surface of the plate configured to control a distance between the pair of probes.

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Suwon-si, South Korea

Hyun-ae Lee