Samsung Display Co., Ltd.

Hyun A Lee

Sangduk Lee

Kikyung Youk

Chan-Jae Park

Daehwan Jang

Sang Duk Lee

Soo Yeon Han

Ki Kyung Youk

Chan Jae Park

Min Soo Kim

Jung Hyun Kim

Yong-Hoon Kwon

Sunok Oh

Heeju Woo

Sun Ok Oh

Yong Hoon Kwon

Byung Hoon Kim

Yong-hoon Kwon

Kyung Rok Ko

Junehyoung Park

June Hyoung Park

So Mi Jung

Tae Oh Kim

Chan-jae Park

Hyunji Lee

Hyun Ji Lee

Daehyuk Im

Somi Jung

Chel Gou Lim

Yoon A Kim

A display panel comprising a display substrate having a display area and a pad area disposed around the display area. A connection wire is disposed on the pad area of the display substrate. A signal wire is disposed on the connection wire. A supporter is disposed between the display substrate and the connection wire. The connection wire directly contacts the supporter.

Display device including connection wire and method for manufacturing the same

A display device includes a display panel including a plurality of pad electrodes, a driving member attached to the display panel and including a plurality of bumps facing the plurality of pad electrodes, respectively, a plurality of conductive particles interposed between the display panel and the driving member, and a plurality of alignment electrodes separated from the plurality of pad electrodes and the plurality of bumps, where an opening is defined in at least one of a pad electrode of the plurality of pad electrodes and a bump of the plurality of bumps includes an opening, and an alignment electrode of the plurality of alignment electrodes is disposed in the opening.

Display device and method of manufacturing the same

A display apparatus includes a display panel having a display region and a non-display region and including a plurality of panel pads disposed in the non-display region, a flexible circuit board including a plurality of connection pads overlapping the plurality of panel pads, and a bonding layer disposed between the display panel and the flexible circuit board and including a conductive polymer, wherein the bonding layer includes a plurality of conductive portions overlapping the plurality of panel pads and the plurality of connection pads and having a first conductivity value, and a plurality of non-conductive portions not overlapping the plurality of panel pads and the plurality of connection pads and having a second conductivity value smaller than the first conductivity value.

Display apparatus and method of manufacturing display apparatus

A display device includes: a first conductive layer including a signal line, which includes a pad contact part and a line part having a smaller width than the pad contact part along a first direction and extending from the pad contact part in a second direction that intersects the first direction, and a first non-contact pattern, which is spaced apart from the pad contact part, on a first side along the first direction; an insulating layer on the first conductive layer and including a contact hole that partially exposes the first conductive layer; and a second conductive layer on the insulating layer and including a first pad electrode, which is electrically connected to the first conductive layer through the contact hole, wherein the first pad electrode overlaps with the pad contact part and the first non-contact pattern.

Display device

A display device includes an electronic component comprising a bump, which includes a first bump portion and a second bump portion that has a surface area less than that of the first bump portion on a plane to surround the first bump portion, a display panel facing the electronic component and including a signal pad that is in contact with the bump, and an adhesive member which is disposed between the display panel and the electronic component and in which an opening overlapping the first bump portion on the plane is defined, wherein the bump is in contact with the signal pad through the opening.

Adhesive member and display device comprising adhesive member and method for manufacturing

A manufacturing method of a display device includes providing an image display layer on a first substrate comprising a first transmission area and a display area around the first transmission area, the pixel layer overlapping the display area, providing a second substrate facing the first substrate, the second substrate comprising a second transmission area overlapping the first transmission area, providing a transparent material between the first transmission area and the second transmission area, and melting each of a portion of the first transmission area adjacent to the transparent material, the transparent material, and a portion of the second transmission area adjacent to the transparent material to form a connection portion that connects the first transmission area and the second transmission area.

Substrate connection structure of display device and method of providing the same

A display panel having a display region and a non-display region, the display panel includes: a substrate having at least one first opening; an electronic component disposed on the substrate; a plurality of pads disposed in the non-display region and including a first pad and a second pad are spaced apart from each other in a first direction with the at least one first opening therebetween; and an adhesive layer disposed between the substrate and the electronic component and overlapping the at least one first opening.

Display panel and manufacturing method for same

An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.

Adhesive member, display device including the same, and method of fabricating display device

A display device includes a display panel including a display area and a non-display area defined therein and including a plurality of signal pads overlapping the non-display area, an electronic component including a base layer with an upper surface and a lower surface, a plurality of driving pads disposed on the lower surface of the base layer, and a plurality of driving bumps respectively disposed on the plurality of driving pads, the plurality of driving bumps being respectively connected to the signal pads, and a filler disposed between the display panel and the electronic component. A first hole is defined in the upper surface of the base layer, and the first hole does not overlap the plurality of driving bumps in a plan view.

A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.

Display device having improved bonding between display panel and encapsulation substrate and method of fabricating the same

A method for manufacturing a display device includes providing an electronic component between a plurality of bumps, providing a display panel, aligning the electronic component and the display panel, and applying ultrasonic waves to bond the plurality of bumps to signal pads. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members.

Method for manufacturing display device

An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.

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Seoul, South Korea

Hyun A Lee