Samsung Electronics Co., Ltd.

K. C. Tech Co., Ltd.

Hyukmin Kim

Jihye Kim

Jaewoo Lee

Jaehak Lee

Sangkyun Kim

Jaeik Lee

Seungho Park

Boyun Kim

Jungeun Kang

Bohyeok Choi

Wooin Lee

A slurry composition is used to treat a surface of a target structure including at least one of a first polishing target film and a second polishing target film, which include different materials from each other, by a chemical mechanical polishing (CMP) process. The slurry composition includes: polishing particles; a first inhibitor including a nonionic polymer to selectively bond to the first polishing target film; and a second inhibitor including an anionic polymer to selectively bond to the second polishing target film. A method of manufacturing an integrated circuit device includes: forming, on a substrate, a target structure including at least one of a first polishing target film and a second polishing target film; applying the slurry composition onto the target structure; and treating a surface of the target structure by a CMP process while the slurry composition covers the target structure.

Slurry composition and method of manufacturing integrated circuit device by using the same

Growing community of inventors

Yongin-si, South Korea

Hyukmin Kim