Lg Chem, Ltd

Samsung Electronics Co., Ltd.

Hyuk-Su Kim

Jin-Ho Kim

Tae-Young Lee

Tae-Duk Nam

Hyoung-Suk Kim

Young-Jin Kim

Ji-Yeon Kim

Tae-Ho Kang

Won-Cheol Lee

Sung-Ryul Park

Tae-hee Song

The present disclosure relates to a lithium secondary battery which ensures reaction uniformity even though it uses a high-loading electrode, and thus has high capacity and improved cycle characteristics. The lithium secondary battery includes: an electrode assembly including a positive electrode, a negative electrode and a separator interposed between the positive electrode and the negative electrode; an electrolyte including a lithium salt and an organic solvent; and a battery casing receiving the electrode assembly and the electrolyte, wherein the positive electrode has a loading amount of 3.5 mAh/cmor more, the separator has an air permeability of 200-1200 sec/100 mL, and the electrolyte has a lithium ion conductivity of 11-20 mS/cm.

Lithium secondary battery

Provided is an electrode for a secondary battery having an electrode current collector either surface or both surfaces of which are coated with two active material layers, the electrode including: an electrode current collector; a first layer of active material coated on the current collector; and a second layer of active material coated on the first layer of active material, wherein a plurality of craters are formed in the first layer of active material and the craters are filled with active material of the second layer. A method for manufacturing the electrode for a secondary battery is also provided, and the method includes carrying out laser ablation on the first layer of active material. According to the present disclosure, it is possible to solve the problem of detachment of the active material layers, particularly the second layer of active material, during the process for manufacturing the electrode.

Electrode having bilayer structure and method for manufacturing the same

The present disclosure is directed to preventing generation of side reactions at a negative electrode, inhibiting an increase in resistance, and improving productivity. An electrode assembly is provided including: a negative electrode including a negative electrode current collector having a negative electrode tab at one end, and a negative electrode active material layer formed on a surface thereof; a positive electrode including a positive electrode current collector having a positive electrode tab at one end, and a positive electrode active material layer formed on a surface thereof; and a separator interposed between the positive and negative electrodes, and including a coating layer containing a conductive material and a polymer binder on the top surface of the negative electrode active material layer, wherein the coating layer is spaced apart from the top end, where the negative electrode tab is formed, and the bottom end by a predetermined distance.

Electrode assembly and method for manufacturing same

Disclosed is an electrode drying device, which includes a drying chamber configured to accommodate a roll-shaped electrode, and a drying unit provided in the drying chamber to dry the electrode, the drying unit being configured to surround the electrode.

Electrode drying device, and battery cell comprising electrode manufactured according to same

A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.

Semiconductor package having supporting plate and method of forming the same

Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.

Growing community of inventors

Daejeon, South Korea

Hyuk-Su Kim