Semes Co., Ltd.

Hyoungkyu Son

Won Seok Lee

Hyeon Gyu Kim

Jae Hyun Cho

Ogsen Galstyan

Jong-Hwan An

Min Keun Bae

Dong Suk Kim

Sung Je Kim

Yu Dong Han

Seon Ok Kim

Provided is a support unit included in an apparatus for treating a substrate using plasma and configured to support the substrate. The support unit may include a power supply rod connected to a high-frequency power supply; an electrode plate configured to receive power from the power supply rod; and a ground ring provided to surround the electrode plate when viewed from the top and including a ground ring to be grounded.

Support unit and apparatus for treating substrate

The inventive concept relates to a substrate support unit provided in an apparatus for treating a substrate using plasma. In an embodiment, the substrate support unit includes a dielectric plate on which the substrate is placed, a lower electrode that is disposed under the dielectric plate and that has a first diameter, a power supply rod that applies RF power to the lower electrode and has a second diameter, and a ground member disposed under the lower electrode and spaced apart from the lower electrode by a first gap by an insulating member, the ground member including a plate portion having a through-hole formed therein through which the power supply rod passes, in which the through-hole has a third diameter.

Substrate treating apparatus and substrate support unit

A support unit provided in an apparatus for treating a substrate using plasma includes a dielectric plate on which the substrate is placed, an electrode plate disposed under the dielectric plate, a power supply rod that applies power to the electrode plate, and a flange that has a shape surrounding the power supply rod and that is spaced apart from the power supply rod.

Support unit and substrate treating apparatus including the same

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Seoul, South Korea

Hyoungkyu Son