Samsung Electronics Co., Ltd.

Hyoungjoon Kim

Kijong Park

SunWon Kang

Eunsung Seo

Kwangil Park

Heejin Lee

Chulsung Park

Kilhyung Cha

Seok-hong Kwon

Jongchul Bak

Keunhwi Koo

Joonyoung Chang

A semiconductor package includes a substrate, first and second semiconductor chip structures on the substrate and spaced apart from each other in a first horizontal direction, a mold layer on the substrate and covering both the first and second semiconductor chip structures, and a supporting structure on the mold layer and distal from the upper surface of the substrate than both the first and second semiconductor chip structures in a vertical direction. The supporting structure includes first and second supporting portions, spaced apart from each other in a second horizontal direction that is perpendicular to the first horizontal direction and the vertical direction. Each of the first and second supporting portions has a bar shape or a linear shape extending in the first horizontal direction. At least one of the first supporting portion or the second supporting portion overlaps the first and second semiconductor chips in the vertical direction.

Semiconductor packages

An image signal processor, an operating method thereof, and an image processing system are provided. The image processing system includes: a control processor configured to generate and output setting information corresponding to N (where N is an integer of 2 or more) image frames; and an image signal processor configured to perform image processing on the N image frames received from an image sensor based on the setting information, and generate an interrupt signal and transmit the interrupt signal to the control processor based on completion of the image processing performed on the N image frame.

Image signal processor, operating method thereof, and image processing system including the image signal processor

A semiconductor package includes a logic chip mounted on a substrate, a first memory chip disposed on the logic chip, which includes a first active surface, and a second memory chip disposed on the first memory chip. The second memory chip is disposed on the first memory chip in such a way that the first memory chip and second memory chip are offset from each other. The second memory chip has a second active surface. The first active surface and the second active surface face each other and are electrically connected to each other through a first solder bump.

Semiconductor package

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Seoul, South Korea

Hyoungjoon Kim