Samsung Techwin Co., Ltd.

Hyoung-ho Roh

Dong-kwan Won

Jae-chul Ryu

Chang-soo Jang

Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.

Printed circuit board and method of manufacturing the same

Provided is a printed circuit board having a structure that can prevent the generation of cracks around a rectangular hole and a method of manufacturing a printed circuit board for a semiconductor package. The printed circuit board includes a base substrate in which at least one window slit is formed, a plurality of circuit patterns formed at least on a side surface of the base substrate, a protective layer formed on the base substrate and the circuit patterns, and a crack preventive layer that is formed along at least a portion of edges of the window slit and is not formed at least on the circuit patterns.

Growing community of inventors

Yongin-si, South Korea

Hyoung-ho Roh