Samsung Electronics Co., Ltd.

Hyouncheol Kim

Junseong Park

Jong-il Park

Seongwan Kim

Youngil Kwon

Inwoo Seo

Kanghun Lee

Wooksung Son

Giduck Kweon

Jaeheung Lee

A vacuum valve includes a valve flange having a first port, a second port, and a valve seat in a space between the first port and the second port, a valve body in the valve flange, the valve body having a contact surface facing the valve seat, and the valve body being moveable to have the contact surface contact the valve seat and to be separated from the valve seat, a disk on the contact surface of the valve body, the disk having an inclined surface inclined toward the second port, and an actuator connected to the valve flange, the actuator being configured to apply a driving force to the valve body to move the contact surface of the valve body into or out of contact with the valve seat.

Vacuum valve and apparatus for fabricating semiconductor having the same

Embodiments of the inventive concepts provide a method of cleaning a furnace-type semiconductor apparatus that is equipped in a clean room and includes a process chamber in which a process of forming a thin film is performed on a substrate. The method includes supplying air of the clean room into the process chamber after the process of forming the thin film, and thermally treating an inside of the process chamber using the air of the clean room supplied to the inside of the process chamber. An adhered material containing chlorine is formed on an inner surface of the process chamber by the process of forming the thin film, and the chlorine of the adhered material is removed by the thermal treatment of the inside of the process chamber.

Furnace-type semiconductor apparatus, method of cleaning the same, and method of forming thin film using the same

Growing community of inventors

Hwaseong-si, South Korea

Hyouncheol Kim