Matsushita Electric Industrial Co., Ltd.

Hyogo Hirohata

Masahiro Oita

Sankichi Shida

Katsuhiko Honjo

Koji Hashimoto

Shinji Okuma

Tatsuro Kikuchi

Tsunehiko Todoroki

Koreaki Nakata

Nobuhiro Hamasaki

Terukazu Kinugasa

Mashiro Oita

Kenichi Fujimura

Tetsuo Hino

Silver alloy for sliding contact, containing 2 to 8% Mo, up to 10% Cu, up to 10% Pd and remainder of Ag. This alloy has high wear resistance, low electrical contact-resistance and low mechanical friction. So, when it is used as a sliding contact material, the sliding contact has a long operation life.

Silver alloy for a sliding contact

An anode comprising a porous sintered body made of tantalum powder each particle of which having a layer of at least one of V, Mo and Pd. This anode permits a solid electrolytic capacitor to have a low reverse current and a low leakage current. This invention also provides an effective method for preparing such anode.

Anode for solid electrolytic capacitor and method for making the same

An etchant comprising an electrolytic liquid which comprises sulfuric acid as a main component and water in such amount that the weight ratio of sulfuric acid to water is between 9:1 and 2:1. The ferrite surface having been electrolytically etched by using this etchant is smooth. Thus, this etchant makes it possible to etch a ferrite to a large depth, and thereby easily shape a ferrite by electrolytic etching, e.g. to define the track width of a magnetic head.

Etchant for electrolytic etching of a ferrite for a magnetic head and

An electrical contact material comprising silver, bismuth oxide and tin oxide with or without tin metal, wherein the amounts of the bismuth and the tin on the basis of the sum weight of the metals in both the metal component and in the metal oxide component are 1.5 to 6 weight percent and 0.1 to 6 weight percent, respectively. This electrical contact material has high resistance to both welding and arc erosion. An advantageous method of making the electrical contact material comprises preparing a metal alloy composed of all the above metals in the above weight ratio and internally oxidizing the bismuth completely in the alloy after shaping the alloy to a desired electrical contact material shape or after crushing the alloy to scaly flakes.

Electrical contact material and method of making the same

An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.

Electroless copper plating solution

A fusible metal film resistor comprising a substrate of an electrically insulating material and a resistive film formed on the substrate, which consists of nickel, 4 to 12 weight % of phosphorus and 0.05 to 10 weight % of at least one additive metal of iron, tin, manganese and bismuth, has a stable and small temperature coefficient of resistance suitable as a precision resistor at a normal load and disconnects easily and rapidly at abnormal overload due to a rapid decrease of resistance at a high temperature which leads to fusion of the film as a result of heat generated by increased current.

Fusible metal film resistor

This invention provides a method for electroless copper plating comprising: providing an electroless copper plating bath composition which comprises 0.005 to 0.3 mole per liter of a water soluble copper compound, 0.005 to 0.6 mole per liter of a cupric complexing agent, 0.02 to 3.0 mole per liter of formaldehyde, 0.01 to 1000 milligram per liter of additive agent selected from the group consisting of 2,2'-dipyridyl, 2,9-dimethyl-1,10-phenanthroline and 2-(2-phridyl)-benzimidazole, and alkaline compound to hold the pH of said aqueous solution 10.5 to 14 and immersing a material having catalytic action at the surface into said electroless copper plating bath composition kept at a temperature of 70.degree. to 90.degree. C whereby copper film with a high mechanical strength is deposited on said material.

Method for electroless copper plating

A connector which has bellows type contacts of spring metal and a holder which has a bottom, a longitudinal slot for receiving a circuit panel, a cavity for housing the bellows type contact, a hollow formed at upper portion of the cavity and partition wall for separating the adjacent contacts. The bellows type contact consists of a lower end portion, an attached portion, a first bent portion, a second bent portion, a straight portion, a third bent portion and an upper end portion. The straight portion is the portion contacting the panel circuit. The contact has a spring substrate which consists of phosphor bronze, a contact metal of tin or tin-lead alloy, and a layer of copper between the substrate and the contact metal. With the improved shape and material of the contact, there is provided better contact performance even for a contact of tin or tin-lead alloy which is very cheap compared to the conventional gold contact and it is thus advantageous for use in consumer type electric equipment.

Growing community of inventors

Neyagawa, Japan

Hyogo Hirohata