Lg Chem, Ltd

Hyo Soon Park

Suk Ky Chang

Hyun Jee Yoo

Jang Soon Kim

Dong Han Kho

Jong Wan Hong

Hyo Sook Joo

Hyun Cheol Kim

Yoon Kyung Kwon

Yong Su Park

Hyun Seong Ko

Je Sik Jung

Do Won Ahn

Nam Jeong Lee

Beom Doo Seo

Heon Sik Song

Hun Jeong

A composition having excellent thermal conductivity and insulating properties and easy of handling includes a thermally conductive filler, a plasticizer, acrylic acid, and an alkyl (meth)acrylate monomer. A heat radiation sheet manufactured from the composition is also provided.

Composition and heat radiation sheet manufactured therefrom

The present invention relates to a foam composition and a foam tape including a foam layer including a cured product thereof.

Foam composition and foam tape including foam layer including cured product thereof

Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5&#x2dc;20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device

The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same

A multilayered film, a back sheet for a photovoltaic cell, methods of manufacturing the film and cell, and a photovoltaic module including the film and cell are provided. The multilayered film includes a resin layer formed on a substrate, and the resin layer contains a fluorine-based polymer and a reactive functional group having an equivalent weight of 30,000 or less. The resin layer containing the fluorine-based polymer has good durability and weatherability and is highly adhesive to the substrate at an interface between the resin layer and the substrate. Also, since a drying process may be performed at a low temperature during manufacture of the multilayered film, manufacturing costs may be reduced, productivity may be increased, and degradation in the quality of products due to thermal deformation or thermal shock may be prevented. The multilayered film may be effectively used as, for example, a back sheet for various photovoltaic modules.

Multilayered film and photovoltaic module including the same

Provided are a multi-layered sheet, a backsheet for a photovoltaic cell, a method of preparing the same and a photovoltaic module. The multi-layered sheet in which a resin layer including a fluorine-based resin has excellent durability and weather resistance, and also exhibits strong interfacial adhesion to a substrate or polymer coating layer is provided. When a drying process is performed at a low temperature in preparation of the multi-layered sheet, production cost can be reduced, producibility can be increased, and degradation in the quality of a product caused by thermal deformation or thermal shock can be prevented. Such a multi-layered sheet may be effectively used as a backsheet for various photovoltaic cells.

Multi-layered sheet and method of preparing same

The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

Dicing die bonding film and dicing method

The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 &#x3bc;m. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

Growing community of inventors

Daejeon, South Korea

Hyo Soon Park