Samsung Electro-mechanics Co., Ltd.

Hyo Min Kang

Jeong Ryeol Kim

Young Oh

Chang Hoon Kim

Hang Kyu Cho

Bum Suk Kang

Jun Oh Kim

Kyoung Jin Cha

Kyung Ryul Lee

Yun Jeong Cha

Ji Eun Oh

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes, wherein the dielectric layer includes silicon (Si), each of the first and second internal electrodes includes Si and a conductive metal, and a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.

Multilayer ceramic electronic component

A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.

Multilayer ceramic electronic component with internal electrode including nickel powder and copper coating layer and method of manufacturing the same

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

Electronic component

A manufacturing method of an electronic component includes forming a body including first and second internal electrodes respectively exposed from first and second end surfaces of the body and dielectric layers disposed between the first and second internal electrodes; applying, on the first and second end surfaces of the body, a paste containing a metal powder and first glass; and sintering the body and the paste to convert the paste to first and second external electrodes including crystalline metal particles having a polyhedral shape and second glass and respectively connected to the first internal electrodes and the second internal electrodes

Manufacturing method of electronic component

Growing community of inventors

Suwon-si, South Korea

Hyo Min Kang