Samsung Electro-mechanics Co., Ltd.

Hyo Kun Bae

Youn Suk Kim

Young Jean Song

Ki Joong Kim

Shinichi Iizuka

Ju Young Park

Jun Goo Won

Jae Hyouck Choi

Sang Hee Kim

Joong Jin Nam

Dae Seok Jang

Seong Geun Kim

An RF power amplifier includes an RF choke coil, a power amplification circuit unit, and an electrostatic discharge (ESD) protection unit. The RF choke coil is connected to a voltage terminal through which an operating voltage is applied. The RF choke coil supplies the operating voltage and interrupts an RF signal. The power amplification circuit unit is supplied with the operating voltage through the RF choke coil. The power amplification circuit unit amplifies an input signal inputted through an input terminal and outputs the amplified input signal through an output terminal. The ESD protection unit is connected between a first connection node and a ground. The ESD protection unit bypasses an ESD voltage from the first connection node to the ground, the first connection node being a node between the voltage terminal and the RF choke coil.

RF power amplifier

A power amplifier includes an inverter amplification section configured to amplify AC components and remove DC components from at least one input signal, an impedance matching section configured to match an impedance of a transmission path of the at least one input signal amplified by the inverter amplification section, and an amplification section configured to amplify an impedance-matched signal from the impedance matching section according to a predetermined gain. The inverter amplification section includes at least one P-channel metal-oxide semiconductor field effect transistor (MOS FET) having a gate configured to receive the at least one input signal and at least one N-channel MOS FET having a gate configured to receive the at least one input signal. The at least one P-channel MOS FET and the at least one N-channel MOS FET are serially connected.

Power amplifier

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Seoul, South Korea

Hyo Kun Bae