Kolon Industries, Inc.

Konlon Industries, Inc.

Hyo Jun Park

Hak Gee Jung

Sang Kyun Kim

Chul Ha Ju

Chung Seock Kang

Sang Min Song

Chang Sik Ha

Young Sik Jeong

Young Han Jeong

Jeong Han Kim

Han Moon Cho

Pradip Kumar Tapaswi

Ki Il Hong

Jong Won Yang

Prdip Kumar Tapaswi

Chae Hyun Lim

Woong Ki Min

Sang Wook Park

Chul Ha Joo

Ye Seul Kim

Disclosed are a polyimide-based film and a method of producing the same, and more particularly, a polyimide-based film having excellent surface evenness and suppressed waviness due to low Kc of 1.55 or less and a method of producing the same.

Polyimide-based film having excellent surface evenness and method for producing same

Disclosed is a plastic substrate, which includes a plastic film, a metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

Plastic substrate and device including the same

Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.

Transparent polyamide-imide resin and film using same

This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (&#x2014;CONH&#x2014;).

High heat-resistant polyamic acid solution and polyimide film

Disclosed is a polyamide-imide precursor having a molecular structure in which a first polymer, derived from polymerization of a dianhydride and a diamine, and a second polymer, derived from polymerization of a diamine and an aromatic dicarbonyl compound, are copolymerized, wherein the diamine includes 3 to 50 mol % of at least one of 9,9-bis(4-aminophenyl)fluorene (FDA) and 9,9-bis(4-amino-3-fluorophenyl)fluorene (F-FDA), based on the total molar amount of the diamine. Also, a copolymerized polyamide-imide in which the polyamide-imide precursor is imidized or a copolymerized polyamide-imide film formed by an imidization reaction of the polyamide-imide precursor and an image display device including the copolymerized polyamide-imide film are provided.

Polyamide-imide precursor, polyamide-imide film, and display device comprising same

This invention relates to polyimide, which includes amorphous silica particles having OH groups thereon and is thus highly heat-resistant, colorless and transparent, and to a polyimide film manufactured using the polyimide.

Polyimide and polyimide film comprising the same

Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

The present invention provides a plastic substrate, including: a polyimide film; a hard coating layer formed on one side of the polyimide film; and a transparent electrode layer formed on the other side of the polyimide film. The plastic substrate has excellent light transmittance high hardness characteristics, superior ITO processability and flexibility. Further, the plastic substrate can function as both a window film and an electrode film when it is applied to a touch screen panel. Thus, the present invention provides a touch screen panel which can be slimmed by reducing the number of laminated films including the plastic substrate.

Plastic substrate, method for producing the same and touch screen panel containing the same

The present invention relates to a novel acid dianhydride, a method for preparing the same, and a polyimide prepared therefrom. More specifically, the acid dianhydride according to the present invention is useful as a colorless transparent polyimide unit exhibiting excellent thermal stability and a low dielectric ratio, and the polyimide of the present invention has excellent solubility to an organic solvent compared with the conventional polyimide.

Acid dianhydride, method for preparing same, and polyimide prepared therefrom

This invention relates to a polyimide and a film using the same and, more particularly, to a polyimide, which can exhibit a low dielectric constant while retaining the superior properties thereof, and can thus be utilized as electronic materials such as protective materials or insulating materials for liquid crystal displays or semiconductors, and optical communication materials such as optical waveguide materials, and to a polyimide film including the same.

Polyimide and film using same

The present invention provides a polyimide film which is both outstandingly transparent and highly heat resistance, and which can be usefully employed as a transparent electrically conductive film, a TFT substrate, a flexible printed circuit substrate, and the like.

Polyimide film

Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2'-bis-trifluoromethyl-4,4&#x2032;-biphenyl diamine), a unit structure derived from 6FDA (4,4&#x2032;-(hexa-fluoroisopropylidene)diphthalic anhydride) and a unit structure derived from TPC (Terephthaloyl chloride; 1,4-benzenedicarbonyl chloride) are copolymerized.

Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer

The present invention provides a polyimide film having a good transparency and also an excellent thermal resistance so that it is useful in a transparent conductive film, TFT substrate, a flexible printing circuit substrate, and the like.

Growing community of inventors

Yongin-si, South Korea

Hyo Jun Park